4WAVE,INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 992
 
  
 
B05C APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 243
 
  
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 1204
 
  
 
H04J MULTIPLEX COMMUNICATION 1124

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8329002 Thin films and methods and machines for forming the thin filmsMar 10, 09Dec 11, 12[C23C]
6819871 Multi-channel optical filter and multiplexer formed from stacks of thin-film layersMar 16, 01Nov 16, 04[G02B, H04J]
6723209 System and method for performing thin film deposition or chemical treatment using an energetic flux of neutral reactive molecular fragments, atoms or radicalsJul 22, 02Apr 20, 04[C23C]
6679976 System and method for performing sputter deposition with multiple targets using independent ion and electron sources and independent target biasing with DC pulse signalsMay 02, 02Jan 20, 04[C23C]
6488821 System and method for performing sputter deposition using a divergent ion beam source and a rotating substrateMay 02, 02Dec 03, 02[C23C]
6419802 System and method for controlling deposition thickness by synchronously varying a sputtering rate of a target with respect to a position of a rotating substrateMar 16, 01Jul 16, 02[C23C, B05C]
6402900 System and method for performing sputter deposition using ion sources, targets and a substrate arranged about the faces of a cubeMar 16, 01Jun 11, 02[C23C]
6402901 System and method for performing sputter deposition using a spherical geometryMar 16, 01Jun 11, 02[C23C]
6402904 System and method for performing sputter deposition using independent ion and electron sources and a target biased with an a-symmetric bi-polar DC pulse signalMar 16, 01Jun 11, 02[C23C]
6402905 System and method for controlling deposition thickness using a mask with a shadow that varies along a radius of a substrateMar 16, 01Jun 11, 02[C23C, B05C]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
7316764 System and method for performing sputter etching using independent ion and electron sources and a substrate biased with an a-symmetric bi-polar DC pulse signalExpiredMar 29, 04Jan 08, 08[C23C]
7177506 Method for forming an aligned optical sub-assemblyExpiredApr 06, 04Feb 13, 07[G02B]
6689255 System and method for making thin-film structures using a stepped profile maskExpiredJun 10, 02Feb 10, 04[C23C]
2002/0174,832 System and method for controlling deposition thickness by synchronously varying a sputtering rate of a target with respect to an angular position of a rotating substrateAbandonedApr 25, 02Nov 28, 02[B31C]
2002/0130,040 System and method for performing sputter deposition using a devergent ion beam source and a rotating substrateAbandonedMar 16, 01Sep 19, 02[C23C, G02B]
6419803 System and method for making thin-film structures using a stepped profile maskExpiredMar 16, 01Jul 16, 02[C23C, B05D]

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