ACM RESEARCH, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 6356
 
  
 
B08B CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 256
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 249
 
  
 
C25F PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR 117

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2014/0224,281 METHODS AND APPARATUS FOR CLEANING FLIP CHIP ASSEMBLIESSep 22, 11Aug 14, 14[H01L]
2014/0053,978 Barrier Layer Removal Method and ApparatusOct 31, 13Feb 27, 14[H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9281177 Methods and apparatus for cleaning semiconductor wafersJun 11, 15Mar 08, 16[H01L, B08B]
8671961 Methods and apparatus for cleaning semiconductor wafersOct 11, 13Mar 18, 14[B08B]
8598039 Barrier layer removal method and apparatusAug 20, 08Dec 03, 13[H01L]
6638863 Electropolishing metal layers on wafers having trenches or vias with dummy structuresMar 27, 02Oct 28, 03[H01L]
6391166 Plating apparatus and methodJan 15, 99May 21, 02[C25D]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2011/0259,752 METHOD FOR SUBSTANTIALLY UNIFORM COPPER DEPOSITION ONTO SEMICONDUCTOR WAFERAbandonedSep 16, 08Oct 27, 11[C25D]
2011/0079,247 SOLUTION PREPARATION APPARATUS AND METHOD FOR TREATING INDIVIDUAL SEMICONDUCTOR WORKPIECEAbandonedMar 17, 08Apr 07, 11[B08B]
2007/0131,561 Controlling removal rate uniformity of an electropolishing process in integrated circuit fabricationAbandonedDec 17, 04Jun 14, 07[B23H]
2007/0125,661 Controlling removal rate uniformity of an electropolishing process in integrated circuit fabricationAbandonedFeb 23, 05Jun 07, 07[B23H]
2007/0052,977 Method and apparatus for end-point detectionAbandonedNov 10, 06Mar 08, 07[G01B]
2007/0039,827 Measuring alignment between a wafer chuck and polishing/plating receptacleAbandonedDec 09, 03Feb 22, 07[B23H]
2007/0023,912 Integrating metal with ultra low-k-dielectricsAbandonedOct 05, 06Feb 01, 07[H01L]
7136173 Method and apparatus for end-point detectionExpiredMay 03, 01Nov 14, 06[G01B]
7119008 Integrating metal layers with ultra low-K dielectricsExpiredSep 18, 01Oct 10, 06[H01L]
2006/0049,056 Electropolishing and electroplating methodsAbandonedApr 11, 03Mar 09, 06[C25D]
2005/0245,086 Adaptive electropolishing using thickness measurement and removal of barrier and sacrificial layersAbandonedJan 06, 05Nov 03, 05[H01L]
2005/0218,003 Electropolishing and/or electroplating apparatus and methodsAbandonedOct 06, 04Oct 06, 05[C25D]
6837984 Methods and apparatus for electropolishing metal interconnections on semiconductor devicesExpiredApr 10, 02Jan 04, 05[C25D, C25F]
2004/0256,245 Methods and apparatus for electropolishing metal interconnections on semiconductor devicesAbandonedJul 21, 04Dec 23, 04[C25D, C25F]
2004/0253,809 Forming a semiconductor structure using a combination of planarizing methods and electropolishingAbandonedAug 10, 04Dec 16, 04[H01L]
2004/0253,810 Dummy structures to reduce metal recess in electropolishing processAbandonedJul 27, 04Dec 16, 04[H01L]
2004/0238,481 Electropolishing assembly and methods for electropolishing conductive layersAbandonedMay 10, 04Dec 02, 04[C23F]
2004/0211,664 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpiecesAbandonedMay 25, 04Oct 28, 04[C25C]
6749728 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpiecesExpiredDec 16, 02Jun 15, 04[C25B]
6726823 Methods and apparatus for holding and positioning semiconductor workpieces during electropolishing and/or electroplating of the workpiecesExpiredMay 23, 01Apr 27, 04[C25D, C25F]

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