ADVANCED CHIP ENGINEERING TECHNOLOGY INC.

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Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 39323
 
  
 
G01B MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS198

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8178963 Wafer level package with die receiving through-hole and method of the sameJan 03, 07May 15, 12[H01L]
8178964 Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for WLP and method of the sameMar 30, 07May 15, 12[H01L]
8058102 Package structure and manufacturing method thereofNov 10, 09Nov 15, 11[H01L]
7985626 Manufacturing tool for wafer level package and method of placing diesJun 20, 05Jul 26, 11[H01L]
7911044 RF module package for releasing stressDec 29, 06Mar 22, 11[H01L]
7884461 System-in-package and manufacturing method of the sameJun 30, 08Feb 08, 11[H01L]
7884464 3D electronic packaging structure having a conductive support substrateJun 27, 06Feb 08, 11[H01L]
7863105 Image sensor package and forming method of the sameMay 08, 08Jan 04, 11[H01L]
7812434 Wafer level package with die receiving through-hole and method of the sameJan 03, 07Oct 12, 10[H01L]
7763494 Semiconductor device package with multi-chips and method of the sameJul 09, 08Jul 27, 10[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2011/0209,908 CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAMEAbandonedDec 17, 10Sep 01, 11[H05K]
2011/0180,891 CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAMEAbandonedAug 26, 10Jul 28, 11[H01L]
2011/0031,594 CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAMEAbandonedMar 03, 10Feb 10, 11[H01L]
2011/0031,607 CONDUCTOR PACKAGE STRUCTURE AND METHOD OF THE SAMEAbandonedAug 06, 09Feb 10, 11[H01L]
2010/0109,156 BACK SIDE PROTECTIVE STRUCTURE FOR A SEMICONDUCTOR PACKAGEAbandonedNov 04, 08May 06, 10[H01L]
2010/0007,017 INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD FOR THE SAMEAbandonedJul 14, 08Jan 14, 10[H01L]
2009/0212,428 RE-DISTRIBUTION CONDUCTIVE LINE STRUCTURE AND THE METHOD OF FORMING THE SAMEAbandonedFeb 22, 08Aug 27, 09[H01L]
2009/0184,425 Conductive line structure and the method of forming the sameAbandonedJan 17, 08Jul 23, 09[H01L]
2009/0166,873 INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF THE SAMEAbandonedDec 27, 07Jul 02, 09[H01L]
2009/0160,052 UNDER BUMP METALLURGY STRUCTURE OF SEMICONDUCTOR DEVICE PACKAGEAbandonedDec 19, 07Jun 25, 09[H01L]
2009/0127,686 Stacking die package structure for semiconductor devices and method of the sameAbandonedNov 21, 07May 21, 09[H01L]
7534632 Method for circuits inspection and method of the sameExpiredFeb 20, 07May 19, 09[G01R]
2009/0096,098 INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF THE SAMEAbandonedOct 15, 07Apr 16, 09[H01L]
2009/0096,093 INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF THE SAMEAbandonedNov 14, 07Apr 16, 09[H01L]
2009/0039,532 SEMICONDUCTOR DEVICE PACKAGE HAVING A BACK SIDE PROTECTIVE SCHEMEAbandonedAug 08, 07Feb 12, 09[H01L]
2009/0008,729 IMAGE SENSOR PACKAGE UTILIZING A REMOVABLE PROTECTION FILM AND METHOD OF MAKING THE SAMEAbandonedJul 03, 07Jan 08, 09[H01L]
2009/0008,777 INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF THE SAMEAbandonedJul 06, 07Jan 08, 09[H01L]
2008/0308,307 TRACE STRUCTURE AND METHOD FOR FABRICATING THE SAMEAbandonedJun 12, 07Dec 18, 08[H05K]
7453148 Structure of dielectric layers in built-up layers of wafer level packageExpiredDec 20, 06Nov 18, 08[H01L]
2008/0274,579 Wafer level image sensor package with die receiving cavity and method of making the sameAbandonedJul 09, 08Nov 06, 08[H01L]

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