ADVANCED SEMICONDUCTOR ENGINEERING, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 77060
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 7184
 
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1878
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 18143
 
 
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 11123
 
 
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 10113
 
 
 
H01K ELECTRIC INCANDESCENT LAMPS 815
 
 
 
H03F AMPLIFIERS 871
 
 
 
H01F MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES 677
 
 
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 5197

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0033,719 SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAMEOct 04, 17Feb 01, 18[H01L, H05K]
2018/0017,741 SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAMEJul 06, 17Jan 18, 18[H01S, G02B, B29C, H01L]
2018/0019,175 SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAMEJul 13, 17Jan 18, 18[H01L]
2018/0019,221 SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAMEJul 13, 17Jan 18, 18[H01L]
2018/0003,894 SEMICONDUCTOR DEVICE PACKAGESJul 01, 16Jan 04, 18[G02B]
2018/0005,846 SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SAMEJun 22, 17Jan 04, 18[H01L]
2017/0363,682 TESTING SYSTEM, METHOD FOR TESTING AN INTEGRATED CIRCUIT AND A CIRCUIT BOARD INCLUDING THE SAMEJun 15, 16Dec 21, 17[G01R]
2017/0365,515 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAMEJun 16, 16Dec 21, 17[H01L]
2017/0365,542 SEMICONDUCTOR DEVICE PACKAGEJun 13, 17Dec 21, 17[H01L]
2017/0365,543 SEMICONDUCTOR DEVICE PACKAGEJun 13, 17Dec 21, 17[H01L]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9881845 Electronic device, lid structure and package structureOct 12, 16Jan 30, 18[H01L, G01N]
9881917 Semiconductor device and method of manufacturing the sameJul 16, 15Jan 30, 18[H01G, H01L]
9871005 Semiconductor device package and method of manufacturing the sameJan 07, 16Jan 16, 18[H01L]
9857532 Semiconductor device packagesJan 13, 17Jan 02, 18[G02B, H01L]
9859232 Semiconductor package device and method of manufacturing the sameNov 04, 16Jan 02, 18[H01L]
9850124 Semiconductor device package for reducing parasitic light and method of manufacturing the sameOct 27, 15Dec 26, 17[B81C, B81B, H01L]
9852971 Interposer, semiconductor package structure, and semiconductor processJun 09, 16Dec 26, 17[H01L]
9853011 Semiconductor package structure and method for manufacturing the sameMar 29, 16Dec 26, 17[H01L]
9837352 Semiconductor device and method for manufacturing the sameJun 10, 16Dec 05, 17[H01L]
9837701 Semiconductor package including antenna substrate and manufacturing method thereofMar 04, 13Dec 05, 17[H01Q, H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2014/0312,496 SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICEABANApr 30, 14Oct 23, 14[H01L]
2014/0252,547 SEMICONDUCTOR DEVICE HAVING INTEGRATED PASSIVE DEVICE AND PROCESS FOR MANUFACTURING THE SAMEABANMar 08, 13Sep 11, 14[H01L]
2014/0239,465 SEMICONDUCTOR PACKAGE HAVING A WAVEGUIDE ANTENNA AND MANUFACTURING METHOD THEREOFABANFeb 28, 13Aug 28, 14[H01L]
2014/0198,459 STACKED PACKAGE DEVICE AND MANUFACTURING METHOD THEREOFABANApr 22, 13Jul 17, 14[H01L]
2014/0001,621 SEMICONDUCTOR PACKAGES HAVING INCREASED INPUT/OUTPUT CAPACITY AND RELATED METHODSABANAug 26, 13Jan 02, 14[H01L]
2013/0249,387 LIGHT-EMITTING DIODES, PACKAGES, AND METHODS OF MAKINGABANMar 20, 12Sep 26, 13[H01J]
2013/0175,324 THERMAL COMPRESSION HEAD FOR FLIP CHIP BONDINGABANJan 11, 12Jul 11, 13[B23K]
2013/0161,670 LIGHT EMITTING DIODE PACKAGES AND METHODS OF MAKINGABANDec 23, 11Jun 27, 13[H01L]
2013/0161,816 SEMICONDUCTOR PACKAGEABANFeb 22, 13Jun 27, 13[H01L]
2013/0134,600 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAMEABANNov 28, 11May 30, 13[H01L]
2013/0122,216 STRUCTURE OF EMBEDDED-TRACE SUBSTRATE AND METHOD OF MANUFACTURING THE SAMEABANJan 04, 13May 16, 13[H05K]
2013/0102,122 SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAMEABANDec 12, 12Apr 25, 13[H01L]
2013/0068,517 SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING THE SAMEABANNov 09, 12Mar 21, 13[H05K]
2013/0037,929 STACKABLE WAFER LEVEL PACKAGES AND RELATED METHODSABANAug 09, 11Feb 14, 13[H01L]
2013/0032,889 Silicon Chip Having Through Via and Method for Making the SameABANAug 08, 12Feb 07, 13[H01L]
2012/0261,689 SEMICONDUCTOR DEVICE PACKAGES AND RELATED METHODSABANApr 13, 11Oct 18, 12[H01L]
2012/0205,800 PACKAGING STRUCTUREABANApr 17, 12Aug 16, 12[H01L]
2012/0119,342 ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOFABANNov 11, 10May 17, 12[H01L]
2012/0104,634 CHIP PACKAGE STRUCTURE AND MANUFACTURING METHODS THEREOFABANJan 09, 12May 03, 12[H01L]
2012/0091,575 Semiconductor Package And Method For Making The SameABANOct 15, 10Apr 19, 12[H01L]

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