ADVANCED SEMICONDUCTOR ENGINEERING, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 75361
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 7087
 
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1871
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 17142
 
 
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 11124
 
 
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 9107
 
 
 
H01K ELECTRIC INCANDESCENT LAMPS 813
 
 
 
H03F AMPLIFIERS 874
 
 
 
H01F MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES 679
 
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 5434

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0301,626 EMBEDDED COMPONENT PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAMEJun 27, 17Oct 19, 17[H01L]
2017/0294,361 LID ARRAY PANEL, PACKAGE WITH LID AND METHOD OF MAKING THE SAMEApr 08, 16Oct 12, 17[H01L]
2017/0294,389 SEMICONDUCTOR PACKAGE STRUCTURE, PACKAGE ON PACKAGE STRUCTURE AND PACKAGING METHODApr 07, 17Oct 12, 17[H01L]
2017/0294,560 SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAMEMar 22, 17Oct 12, 17[H01L]
2017/0294,564 SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAMEJan 10, 17Oct 12, 17[H01L]
2017/0287,738 FAN-OUT WAFER LEVEL PACKAGING STRUCTUREJun 20, 17Oct 05, 17[H01L]
2017/0287,863 SEMICONDUCTOR DIE, SEMICONDUCTOR WAFER AND METHOD FOR MANUFACTURING THE SAMEJun 20, 17Oct 05, 17[H01L]
2017/0287,871 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAMEMar 29, 16Oct 05, 17[H01L]
2017/0278,814 SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGESMar 22, 16Sep 28, 17[H01L]
2017/0278,823 PACKAGE PROCESS AND PACKAGE STRUCTUREJun 12, 17Sep 28, 17[H01L]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9812387 Semiconductor substrate, semiconductor module and method for manufacturing the sameNov 29, 16Nov 07, 17[H01L, H05K]
9773753 Semiconductor devices and methods of manufacturing the sameNov 18, 16Sep 26, 17[H01L]
9768103 Fabrication method of embedded chip substrateJan 07, 16Sep 19, 17[H01L, H05K]
9768139 Semiconductor device and semiconductor packageOct 19, 16Sep 19, 17[H01L]
9754906 Double plated conductive pillar package substrateJun 25, 15Sep 05, 17[H01L]
9748196 Semiconductor package structure including die and substrate electrically connected through conductive segmentsSep 15, 14Aug 29, 17[H01L]
9741675 Bump structures, semiconductor device and semiconductor device package having the sameJan 16, 15Aug 22, 17[H01L]
9728451 Through silicon vias for semiconductor devices and manufacturing method thereofAug 21, 14Aug 08, 17[H01L]
9721799 Semiconductor package with reduced via hole width and reduced pad patch and manufacturing method thereofNov 07, 14Aug 01, 17[H01L]
9721899 Embedded component package structure and method of manufacturing the sameJun 05, 15Aug 01, 17[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2014/0312,496 SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICEABANApr 30, 14Oct 23, 14[H01L]
2014/0252,547 SEMICONDUCTOR DEVICE HAVING INTEGRATED PASSIVE DEVICE AND PROCESS FOR MANUFACTURING THE SAMEABANMar 08, 13Sep 11, 14[H01L]
2014/0239,465 SEMICONDUCTOR PACKAGE HAVING A WAVEGUIDE ANTENNA AND MANUFACTURING METHOD THEREOFABANFeb 28, 13Aug 28, 14[H01L]
2014/0198,459 STACKED PACKAGE DEVICE AND MANUFACTURING METHOD THEREOFABANApr 22, 13Jul 17, 14[H01L]
2014/0001,621 SEMICONDUCTOR PACKAGES HAVING INCREASED INPUT/OUTPUT CAPACITY AND RELATED METHODSABANAug 26, 13Jan 02, 14[H01L]
2013/0249,387 LIGHT-EMITTING DIODES, PACKAGES, AND METHODS OF MAKINGABANMar 20, 12Sep 26, 13[H01J]
2013/0175,324 THERMAL COMPRESSION HEAD FOR FLIP CHIP BONDINGABANJan 11, 12Jul 11, 13[B23K]
2013/0161,670 LIGHT EMITTING DIODE PACKAGES AND METHODS OF MAKINGABANDec 23, 11Jun 27, 13[H01L]
2013/0161,816 SEMICONDUCTOR PACKAGEABANFeb 22, 13Jun 27, 13[H01L]
2013/0134,600 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAMEABANNov 28, 11May 30, 13[H01L]
2013/0122,216 STRUCTURE OF EMBEDDED-TRACE SUBSTRATE AND METHOD OF MANUFACTURING THE SAMEABANJan 04, 13May 16, 13[H05K]
2013/0102,122 SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAMEABANDec 12, 12Apr 25, 13[H01L]
2013/0068,517 SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING THE SAMEABANNov 09, 12Mar 21, 13[H05K]
2013/0037,929 STACKABLE WAFER LEVEL PACKAGES AND RELATED METHODSABANAug 09, 11Feb 14, 13[H01L]
2013/0032,889 Silicon Chip Having Through Via and Method for Making the SameABANAug 08, 12Feb 07, 13[H01L]
2012/0261,689 SEMICONDUCTOR DEVICE PACKAGES AND RELATED METHODSABANApr 13, 11Oct 18, 12[H01L]
2012/0205,800 PACKAGING STRUCTUREABANApr 17, 12Aug 16, 12[H01L]
2012/0119,342 ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOFABANNov 11, 10May 17, 12[H01L]
2012/0104,634 CHIP PACKAGE STRUCTURE AND MANUFACTURING METHODS THEREOFABANJan 09, 12May 03, 12[H01L]
2012/0091,575 Semiconductor Package And Method For Making The SameABANOct 15, 10Apr 19, 12[H01L]

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