ADVANCED TECHNOLOGY INTERCONNECT INCORPORATED

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 2154
 
  
 
B23P OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS 155
 
  
 
G06K RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS 1197
 
  
 
H01K ELECTRIC INCANDESCENT LAMPS 121

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
5483603 System and method for automatic optical inspectionOct 17, 94Jan 09, 96[G06K]
5378857 Directly bondable termination for a fixed discrete wireJan 15, 93Jan 03, 95[H05K]
5365657 Method and apparatus for cutting wireFeb 01, 93Nov 22, 94[H01K, B23P]
5340946 Heat activatable adhesive for wire scribed circuitsApr 14, 92Aug 23, 94[H05K]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
6300673 Edge connectable metal packageExpiredMay 05, 95Oct 09, 01[H01L]
6262477 Ball grid array electronic packageExpiredMar 19, 93Jul 17, 01[H01L]
6188130 Exposed heat spreader with seal ringExpiredJun 14, 99Feb 13, 01[H01L]
5998905 Slotless electric motor or transducer and method for making sameExpiredMay 28, 97Dec 07, 99[H02K]
5969414 Semiconductor package with molded plastic bodyExpiredMay 25, 94Oct 19, 99[H01L]
5952083 Aluminum alloys for electronic componentsExpiredOct 21, 97Sep 14, 99[H01L]
5952719 Metal ball grid electronic package having improved solder jointExpiredJul 10, 97Sep 14, 99[H01L]
5939214 Thermal performance package for integrated circuit chipExpiredNov 24, 92Aug 17, 99[H01L]
5877551 Semiconductor package having a ground or power ring and a metal substrateExpiredNov 18, 96Mar 02, 99[H01L]
5805427 Ball grid array electronic package standoff designExpiredFeb 14, 96Sep 08, 98[H05K]
5764484 Ground ring for a metal electronic packageExpiredNov 15, 96Jun 09, 98[H01L]
5715590 Apparatus for making a slotless electric motor or transducerExpiredJun 06, 95Feb 10, 98[H02K]
5688606 Anodized aluminum substrate having increased breakdown voltageExpiredApr 18, 96Nov 18, 97[C25D, B21D, B32B]
5650663 Electronic package with improved thermal propertiesExpiredJul 03, 95Jul 22, 97[H01L]
5629835 Metal ball grid array package with improved thermal conductivityExpiredJul 19, 94May 13, 97[H01L, H05K]
5606791 Method of making a slotless electric motor or transducerExpiredSep 17, 93Mar 04, 97[H02K]
5608267 Molded plastic semiconductor package including heat spreaderExpiredJul 18, 94Mar 04, 97[H01L]
5578869 Components for housing an integrated circuit deviceExpiredMar 29, 94Nov 26, 96[H01L]
5559306 Electronic package with improved electrical performanceExpiredOct 11, 95Sep 24, 96[H01L]
5545850 Guard ring for integrated circuit packageExpiredJan 13, 95Aug 13, 96[H01L]

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