ADVANTEST AMERICA, INC

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 26133
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 4358
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 348
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 3130
 
  
 
B23P OTHER WORKING OF METAL; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS 155

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

  • No Recent Publications to Display

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9678108 Methods to manufacture semiconductor probe tipsFeb 11, 14Jun 13, 17[H01R, G01R]
9194887 Fine pitch probes for semiconductor testing, and a method to fabricate and assemble sameJan 17, 13Nov 24, 15[G01R]
9000793 Fine pitch probes for semiconductor testing, and a method to fabricate and assemble sameJan 17, 13Apr 07, 15[H01L, G01R]
8917106 Fine pitch microelectronic contact array and method of making sameNov 09, 11Dec 23, 14[G01R, H05K]
8901950 Probe head for a microelectronic contactor assembly, and methods of making sameFeb 19, 10Dec 02, 14[G01R]
8747642 Superfilling secondary metallization process in MEMS fabricationOct 29, 09Jun 10, 14[C25D]
8344748 Probe for testing semiconductor devicesJan 25, 10Jan 01, 13[G01R]
8309382 Multi material secondary metallization scheme in MEMS fabricationOct 29, 09Nov 13, 12[H01L]
8305101 Microelectronic contactor assembly, structures thereof, and methods of constructing sameFeb 19, 10Nov 06, 12[G01R]
8278956 Probecard system and methodApr 08, 10Oct 02, 12[G01R]

View all patents..

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2010/0308,854 PROBE CARD SUBSTRATE WITH BONDED VIAAbandonedApr 05, 10Dec 09, 10[H01R, G01R]
7589547 Forked probe for testing semiconductor devicesExpiredSep 13, 07Sep 15, 09[G01R]
2009/0072,851 Multi-Pivot Probe Card For Testing Semiconductor DevicesAbandonedSep 10, 08Mar 19, 09[G01R]
2008/0228,301 SYSTEM TO OPTIMIZE A SEMICONDUCTOR PROBE CARDAbandonedMar 15, 07Sep 18, 08[G06F]
7378734 Stacked contact bumpExpiredMay 30, 06May 27, 08[H01L]

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.