ALCHIMER

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 13349
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 744
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 398
 
  
 
C08F MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS 2123
 
  
 
C08J WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER- TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C C08F, C08G or C08H 276

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9564333 Method for forming a metal silicide using a solution containing gold ions and fluorine ionsFeb 21, 14Feb 07, 17[C23C, H01L]
9368397 Method for forming a vertical electrical connection in a layered semiconductor structureMay 22, 12Jun 14, 16[H01L]
9190283 Method of depositing metallic layers based on nickel or cobalt on a semiconducting solid substrate; kit for application of said methodApr 18, 12Nov 17, 15[C23C, H01L]
9181623 Solution and process for activating the surface of a semiconductor substrateSep 09, 10Nov 10, 15[C23C, H01L]
9133560 Electroplating composition for coating a substrate surface with a metalSep 20, 06Sep 15, 15[C25D, H01L]
8883641 Solution and method for activating the oxidized surface of a semiconductor substrateSep 30, 10Nov 11, 14[C23C, H01L]
8795503 Device and method to conduct an electrochemical reaction on a surface of a semi-conductor substrateMar 25, 10Aug 05, 14[C25D, H01L]
8784635 Formation of organic electro-grafted films on the surface of electrically conductive or semi-conductive surfacesFeb 28, 07Jul 22, 14[C25D, C09D]
8591715 Electrodeposition composition and method for coating a semiconductor substrate using the said compositionMay 04, 09Nov 26, 13[C25D, H01L]
8574418 Electroplating method for coating a substrate surface with a metalSep 20, 06Nov 05, 13[C25D, H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
8524512 Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this methodExpiredSep 07, 09Sep 03, 13[H01L]
2013/0168,255 COPPER-ELECTROPLATING COMPOSITION AND PROCESS FOR FILLING A CAVITY IN A SEMICONDUCTOR SUBSTRATE USING THIS COMPOSITIONAbandonedJun 09, 11Jul 04, 13[C25D]
8298946 Method of selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuitsExpiredMar 22, 05Oct 30, 12[H01L]
2011/0192,462 SOLAR CELLSAbandonedDec 31, 10Aug 11, 11[H01L]
2011/0162,701 Photovoltaic CellsAbandonedJan 03, 10Jul 07, 11[H01L]
7247226 Coating support and method for the selective coating of conductive tracks on one such supportExpiredAug 26, 03Jul 24, 07[C25D]
2007/0062,817 Method of coating a surface of a substrate with a metal by electroplatingAbandonedNov 04, 05Mar 22, 07[C25D]
2007/0062,818 Electroplating composition intended for coating a surface of a substrate with a metalAbandonedNov 04, 05Mar 22, 07[C25D]
2006/0211,236 Surface-coating method, production of microelectronic interconnections using said method and integrated circuitsAbandonedFeb 13, 04Sep 21, 06[H01L]

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