ALCHIMER

7,196,385 Microstructure comprising a surface which is functionalized through the localized deposit of a thin layer and production method thereofAug 25, 03Mar 27, 07[H01L]1

Recent Publications

2012/0196,441 SOLUTION AND METHOD FOR ACTIVATING THE OXIDIZED SURFACE OF A SEMICONDUCTOR SUBSTRATESep 30, 10Aug 02, 12[C09D, H01L]

2012/0156,892 SOLUTION AND PROCESS FOR ACTIVATING THE SURFACE OF A SEMICONDUCTOR SUBSTRATESep 09, 10Jun 21, 12[C09D, B05D, H01L]

2012/0000,785 DEVICE AND METHOD TO CONDUCT AN ELECTROCHEMICAL REACTION ON A SURFACE OF A SEMI-CONDUCTOR SUBSTRATEMar 25, 10Jan 05, 12[C25D, C25B]

2011/0294,231 METHOD FOR REPAIRING COPPER DIFFUSION BARRIER LAYERS ON A SEMICONDUCTOR SOLID SUBSTRATE AND REPAIR KIT FOR IMPLEMENTING THIS METHODSep 07, 09Dec 01, 11[C09D, H01L, B82Y]

2011/0192,462 SOLAR CELLSDec 31, 10Aug 11, 11[H01L]

2011/0162,701 Photovoltaic CellsJan 03, 10Jul 07, 11[H01L]

2010/0038,256 ELECTROPLATING METHOD FOR COATING A SUBSTRATE SURFACE WITH A METALSep 20, 06Feb 18, 10[C25D]

2010/0003,808 METHOD OF PREPARING AN ELECTRICALLY INSULATING FILM AND APPLICATION FOR THE METALLIZATION OF VIASJun 30, 09Jan 07, 10[B05D, H01L, H05K]

2009/0301,862 METHOD FOR MODIFYING INSULATING OR SEMI-CONDUCTIVE SURFACES, AND RESULTING PRODUCTSOct 09, 06Dec 10, 09[B01J]

2009/0294,293 ELECTRODEPOSITION COMPOSITION AND METHOD FOR COATING A SEMICONDUCTOR SUBSTRATE USING THE SAID COMPOSITIONMay 04, 09Dec 03, 09[C25D]

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Recent Patents

8,405,217 Coating method and solutions for enhanced electromigration resistanceMar 05, 07Mar 26, 13[H01L]

8,298,946 Method of selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuitsMar 22, 05Oct 30, 12[H01L]

8,133,549 Method for modifying insulating or semi-conductive surfaces, and resulting productsOct 09, 06Mar 13, 12[C08J, C08F, H01L]

8,119,542 Method of preparing an electrically insulating film and application for the metallization of viasJun 30, 09Feb 21, 12[H01L]

7,968,653 Modification process for polymer surfaces, notably for hydroxylation of polymer surfaces and products so obtainedOct 10, 06Jun 28, 11[C08F]

7,956,099 Modification process for polymer surfaces, notably for hydroxylation of polymer surfaces and products so obtainedOct 10, 06Jun 07, 11[C08J]

7,579,274 Method and compositions for direct copper plating and filing to form interconnects in the fabrication of semiconductor devicesFeb 20, 07Aug 25, 09[H01L]

7,196,385 Microstructure comprising a surface which is functionalized through the localized deposit of a thin layer and production method thereofAug 25, 03Mar 27, 07[H01L]