ALPHA AND OMEGA SEMICONDUCTOR INCORPORATED

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 53789
 
 
 
H02M APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF 1690
 
 
 
G05F SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES 1385
 
 
 
H03K PULSE TECHNIQUE 11121
 
 
 
H02H EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS 1074
 
 
 
H01F MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES 777
 
 
 
H05B ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR 5106
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 2161
 
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 2439
 
 
 
H02J CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY 2117

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0005,959 TRENCH MOSFET DEVICE AND THE PREPARATION METHOD THEREOFJun 30, 16Jan 04, 18[H01L]
2018/0006,026 BIDIRECTIONAL SWITCH HAVING BACK TO BACK FIELD EFFECT TRANSISTORSJun 30, 16Jan 04, 18[H01L]
2017/0373,185 NANO MOSFET WITH TRENCH BOTTOM OXIDE SHIELDED AND THIRD DIMENSIONAL P-BODY CONTACTAug 18, 17Dec 28, 17[H01L]
2017/0338,337 DEVICE STRUCTURE HAVING INTER-DIGITATED BACK TO BACK MOSFETSMay 20, 16Nov 23, 17[H01L]
2017/0287,903 VARIABLE SNUBBER FOR MOSFET APPLICATIONJun 14, 17Oct 05, 17[H01L]
2017/0288,028 SELF-ALIGNED CONTACT FOR TRENCH POWER MOSFETJun 14, 17Oct 05, 17[H01L]
2017/0194,492 BOTTOM SOURCE NMOS TRIGGERED ZENER CLAMP FOR CONFIGURING AN ULTRA-LOW VOLTAGE TRANSIENT VOLTAGE SUPPRESSOR (TVS)Sep 25, 13Jul 06, 17[H01L]
2017/0179,107 TRANSIENT VOLTAGE SUPPRESSOR (TVS) WITH REDUCED BREAKDOWN VOLTAGEFeb 28, 17Jun 22, 17[H01L]
2017/0148,910 TERMINATION DESIGN FOR HIGH VOLTAGE DEVICEFeb 06, 17May 25, 17[H01L]
2017/0133,473 SPLIT-GATE TRENCH POWER MOSFET WITH PROTECTED SHIELD OXIDEJan 23, 17May 11, 17[H01L]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9865678 High voltage field balance metal oxide field effect transistor (FBM)Aug 12, 16Jan 09, 18[H01L]
9865694 Split-gate trench power mosfet with protected shield oxideJan 23, 17Jan 09, 18[H01L]
9853143 Closed cell lateral MOSFET using silicide source and body regions with self-aligned contactsApr 11, 16Dec 26, 17[H01L]
9853548 Accurate high-side current emulation with auto-conversion for smart power stage applicationsFeb 06, 17Dec 26, 17[H02M]
9846469 Fault tolerant power supply incorporating intelligent load switch to provide uninterrupted powerMay 16, 16Dec 19, 17[G06F, H02J]
9837386 Power device and preparation method thereofJan 12, 16Dec 05, 17[H01L, H02M]
9837400 JEFT and LDMOS transistor formed using deep diffusion regionsSep 07, 16Dec 05, 17[H01L]
9818829 Split poly connection via through-poly-contact (TPC) in split-gate based power MOSFETsJul 19, 16Nov 14, 17[H01L]
9806175 Power MOSFET device structure for high frequency applicationsFeb 23, 15Oct 31, 17[H01L]
9793153 Low cost and mask reduction method for high voltage devicesFeb 27, 15Oct 17, 17[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0218,008 POWER DEVICE WITH HIGH ASPECT RATIO TRENCH CONTACTS AND SUBMICRON PITCHES BETWEEN TRENCHESABANJan 23, 15Jul 28, 16[H01L]
2016/0099,310 SEMICONDUCTOR DEVICE INTEGRATING HIGH AND LOW VOLTAGE DEVICESABANDec 14, 15Apr 07, 16[H01L]
2015/0340,301 SUBSTRATELESS POWER DEVICE PACKAGESABANAug 04, 15Nov 26, 15[H01L]
2015/0255,930 INTERFACES WITH BUILT-IN TRANSIENT VOLTAGE SUPPRESSIONABANMar 04, 14Sep 10, 15[H01R, H02H, H05K]
2015/0076,676 POWER SEMICONDUCTOR DEVICE PACKAGE AND FABRICATION METHODABANSep 17, 13Mar 19, 15[H01L]
2013/0224,919 METHOD FOR MAKING GATE-OXIDE WITH STEP-GRADED THICKNESS IN TRENCHED DMOS DEVICE FOR REDUCED GATE-TO-DRAIN CAPACITANCEABANFeb 28, 12Aug 29, 13[H01L]
2013/0099,364 Top-side Cooled Semiconductor Package with Stacked Interconnection Plates and MethodABANDec 11, 12Apr 25, 13[H01L]
2013/0069,154 SEMICONDUCTOR CHIP INTEGRATING HIGH AND LOW VOLTAGE DEVICESABANSep 20, 11Mar 21, 13[H01L]
2013/0069,157 SEMICONDUCTOR CHIP INTEGRATING HIGH AND LOW VOLTAGE DEVICESABANJun 30, 12Mar 21, 13[H01L]
2013/0071,994 METHOD OF INTEGRATING HIGH VOLTAGE DEVICESABANJun 30, 12Mar 21, 13[H01L]
2012/0142,165 Method of Avoiding Resin Outflow from the Wafer Scribe line in WLCSPABANMar 10, 11Jun 07, 12[H01L]
2012/0126,317 ACCUFET WITH INTEGRATED CLAMPING CIRCUITABANNov 18, 10May 24, 12[H01L]
2012/0007,206 Structures and methods for forming schottky diodes on a p-substrate or a bottomanode schottky diodeABANAug 23, 11Jan 12, 12[H01L]
2011/0294,262 SEMICONDUCTOR PACKAGE PROCESS WITH IMPROVED DIE ATTACH METHOD FOR ULTRATHIN CHIPSABANMay 29, 10Dec 01, 11[H01L]
2011/0068,457 Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing methodABANSep 21, 09Mar 24, 11[H01L]
2011/0049,580 Hybrid Packaged Gate Controlled Semiconductor Switching Device Using GaN MESFETABANAug 28, 09Mar 03, 11[H01L]
2010/0327,314 Insulated Gate Bipolar Transistor (IGBT) Collector Formed with Ge/A1 and Production MethodABANJun 28, 09Dec 30, 10[H01L]
2010/0015,770 Double gate manufactured with locos techniquesABANSep 18, 09Jan 21, 10[H01L]

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