ALPHA AND OMEGA SEMICONDUCTOR INCORPORATED

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 54291
 
 
 
H02M APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF 1785
 
 
 
G05F SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES 1387
 
 
 
H02H EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS 1166
 
 
 
H03K PULSE TECHNIQUE 11120
 
 
 
H01F MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES 777
 
 
 
H05B ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR 5106
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 2157
 
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 2445
 
 
 
H02J CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY 2118

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0062,386 USB TYPE-C LOAD SWITCH ESD PROTECTIONAug 23, 16Mar 01, 18[H02H, H01L]
2018/0006,026 BIDIRECTIONAL SWITCH HAVING BACK TO BACK FIELD EFFECT TRANSISTORSJun 30, 16Jan 04, 18[H01L]
2017/0373,185 NANO MOSFET WITH TRENCH BOTTOM OXIDE SHIELDED AND THIRD DIMENSIONAL P-BODY CONTACTAug 18, 17Dec 28, 17[H01L]
2017/0338,337 DEVICE STRUCTURE HAVING INTER-DIGITATED BACK TO BACK MOSFETSMay 20, 16Nov 23, 17[H01L]
2017/0288,028 SELF-ALIGNED CONTACT FOR TRENCH POWER MOSFETJun 14, 17Oct 05, 17[H01L]
2017/0194,492 BOTTOM SOURCE NMOS TRIGGERED ZENER CLAMP FOR CONFIGURING AN ULTRA-LOW VOLTAGE TRANSIENT VOLTAGE SUPPRESSOR (TVS)Sep 25, 13Jul 06, 17[H01L]
2017/0179,107 TRANSIENT VOLTAGE SUPPRESSOR (TVS) WITH REDUCED BREAKDOWN VOLTAGEFeb 28, 17Jun 22, 17[H01L]
2017/0133,473 SPLIT-GATE TRENCH POWER MOSFET WITH PROTECTED SHIELD OXIDEJan 23, 17May 11, 17[H01L]
2017/0117,386 LATERAL SUPER JUNCTION DEVICE WITH HIGH SUBSTRATE-GATE BREAKDOWN AND BUILT-IN AVALANCHE CLAMP DIODEFeb 10, 13Apr 27, 17[H01L]
2017/0093,281 SYSTEM AND METHOD FOR EXTENDING THE MAXIMUM DUTY CYCLE OF A STEP-DOWN SWITCHING CONVERTER WITHOUT MAXIMUM DUTY CONTROLSep 24, 15Mar 30, 17[H02M]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9911728 Transient voltage suppressor (TVS) with reduced breakdown voltageFeb 28, 17Mar 06, 18[H01L]
9911840 Self aligned trench MOSFET with integrated diodeMar 02, 15Mar 06, 18[H01L]
9899471 Compact CMOS device isolationDec 08, 16Feb 20, 18[H01L]
9899474 Nanotube semiconductor devicesJun 08, 17Feb 20, 18[H01L]
9899931 Zero voltage switching flyback converter for primary switch turn-off transitionsOct 25, 16Feb 20, 18[H02M]
9893209 Cascoded high voltage junction field effect transistorMay 13, 14Feb 13, 18[H01L]
9887283 Process method and structure for high voltage MOSFETsMay 10, 13Feb 06, 18[H01L]
9882049 Self-aligned slotted accumulation-mode field effect transistor (AccuFET) structure and methodOct 06, 14Jan 30, 18[H01L]
9876072 Configurations and methods for manufacturing charged balanced devicesJun 14, 16Jan 23, 18[H01L]
9876073 Integrated Schottky diode in high voltage semiconductor deviceApr 05, 17Jan 23, 18[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0099,310 SEMICONDUCTOR DEVICE INTEGRATING HIGH AND LOW VOLTAGE DEVICESAbandonedDec 14, 15Apr 07, 16[H01L]
2016/0056,098 SEMICONDUCTOR DEVICE EMPLOYING ALUMINUM ALLOY LEAD-FRAME WITH ANODIZED ALUMINUMAbandonedMar 11, 14Feb 25, 16[H01L]
2016/0049,876 SINGLE PACKAGE SYNCHRONOUS RECTIFIERAbandonedAug 12, 14Feb 18, 16[H02M]
2015/0340,301 SUBSTRATELESS POWER DEVICE PACKAGESAbandonedAug 04, 15Nov 26, 15[H01L]
2015/0255,930 INTERFACES WITH BUILT-IN TRANSIENT VOLTAGE SUPPRESSIONAbandonedMar 04, 14Sep 10, 15[H01R, H02H, H05K]
2015/0076,676 POWER SEMICONDUCTOR DEVICE PACKAGE AND FABRICATION METHODAbandonedSep 17, 13Mar 19, 15[H01L]
2013/0224,919 METHOD FOR MAKING GATE-OXIDE WITH STEP-GRADED THICKNESS IN TRENCHED DMOS DEVICE FOR REDUCED GATE-TO-DRAIN CAPACITANCEAbandonedFeb 28, 12Aug 29, 13[H01L]
8471332 Enhancing Schottky breakdown voltage (BV) without affecting an integrated MOSFET-Schottky device layoutExpiredJan 12, 12Jun 25, 13[H01L]
8471368 Polysilicon control etch back indicatorExpiredMar 27, 12Jun 25, 13[H01L]
2013/0099,364 Top-side Cooled Semiconductor Package with Stacked Interconnection Plates and MethodAbandonedDec 11, 12Apr 25, 13[H01L]
2013/0069,154 SEMICONDUCTOR CHIP INTEGRATING HIGH AND LOW VOLTAGE DEVICESAbandonedSep 20, 11Mar 21, 13[H01L]
2013/0069,157 SEMICONDUCTOR CHIP INTEGRATING HIGH AND LOW VOLTAGE DEVICESAbandonedJun 30, 12Mar 21, 13[H01L]
2013/0071,994 METHOD OF INTEGRATING HIGH VOLTAGE DEVICESAbandonedJun 30, 12Mar 21, 13[H01L]
2012/0142,165 Method of Avoiding Resin Outflow from the Wafer Scribe line in WLCSPAbandonedMar 10, 11Jun 07, 12[H01L]
2012/0126,317 ACCUFET WITH INTEGRATED CLAMPING CIRCUITAbandonedNov 18, 10May 24, 12[H01L]
2012/0007,206 Structures and methods for forming schottky diodes on a p-substrate or a bottomanode schottky diodeAbandonedAug 23, 11Jan 12, 12[H01L]
2011/0294,262 SEMICONDUCTOR PACKAGE PROCESS WITH IMPROVED DIE ATTACH METHOD FOR ULTRATHIN CHIPSAbandonedMay 29, 10Dec 01, 11[H01L]
2011/0068,457 Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing methodAbandonedSep 21, 09Mar 24, 11[H01L]
2011/0049,580 Hybrid Packaged Gate Controlled Semiconductor Switching Device Using GaN MESFETAbandonedAug 28, 09Mar 03, 11[H01L]
2010/0327,314 Insulated Gate Bipolar Transistor (IGBT) Collector Formed with Ge/A1 and Production MethodAbandonedJun 28, 09Dec 30, 10[H01L]

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