AMKOR ELECTRONICS, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 7355
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 4152
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 1132

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
5986334 Semiconductor package having light, thin, simple and compact structureOct 02, 97Nov 16, 99[H01L]
5829988 Socket assembly for integrated circuit chip carrier packageNov 14, 96Nov 03, 98[H01R, H05K]
5827999 Homogeneous chip carrier packageNov 14, 94Oct 27, 98[H01L]
5722161 Method of making a packaged semiconductor die including heat sink with locking featureMay 01, 96Mar 03, 98[H05K]
5672909 Interdigitated wirebond programmable fixed voltage planesJul 29, 96Sep 30, 97[H01L]
5650593 Thermally enhanced chip carrier packageFeb 06, 95Jul 22, 97[H01L, H05K]
5471011 Homogeneous thermoplastic semi-conductor chip carrier packageMay 26, 94Nov 28, 95[H01L]
5355283 Ball grid array with via interconnectionApr 14, 93Oct 11, 94[H01L, H05K]
5328870 Method for forming plastic molded package with heat sink for integrated circuit devicesNov 09, 92Jul 12, 94[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
5305043 Method of and apparatus for producing a strip of lead frames for integrated circuit dies in a continuous systemExpiredAug 27, 92Apr 19, 94[G03B]
5269210 Slitter machine for use in manufacturing semiconductor devicesExpiredSep 23, 91Dec 14, 93[B26D, B23B]
5183724 Method of producing a strip of lead frames for integrated circuit dies in a continuous systemExpiredDec 18, 90Feb 02, 93[H01L, G03C]

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