AMKOR TECHNOLOGY, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 84758
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 9469
 
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1776
 
 
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 16117
 
 
 
G06K RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS 15183
 
 
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 12116
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 11148
 
 
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 11194
 
 
 
B81B MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES 924
 
 
 
H01K ELECTRIC INCANDESCENT LAMPS 913

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0047,692 Method and System for Packing Optimization of Semiconductor DevicesAug 10, 16Feb 15, 18[H01L]
2017/0200,686 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOFMay 06, 16Jul 13, 17[H01L]
2017/0200,782 CAPACITOR OF SEMICONDUCTOR INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING THE SAMEMay 06, 16Jul 13, 17[H01L]
2017/0162,535 TRANSIENT INTERFACE GRADIENT BONDING FOR METAL BONDSDec 08, 15Jun 08, 17[H01L]
2017/0154,861 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOFFeb 10, 17Jun 01, 17[H01L]
2017/0141,046 SEMICONDUCTOR DEVICE WITH AN ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDMay 09, 16May 18, 17[H01L]
2017/0133,310 SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOFJan 06, 17May 11, 17[H01L]
2017/0133,334 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOFNov 09, 15May 11, 17[H01L]
2017/0117,214 SEMICONDUCTOR DEVICE WITH THROUGH-MOLD VIADec 26, 16Apr 27, 17[H01L]
2016/0343,593 SEMICONDUCTOR PACKAGE INCLUDING PREMOLD AND METHOD OF MANUFACTURING THE SAMEJul 05, 16Nov 24, 16[H01L]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9922919 Electronic package structure having insulated substrate with lands and conductive patternsDec 30, 15Mar 20, 18[H01L]
9916989 System and method for laser assisted bonding of semiconductor dieApr 15, 16Mar 13, 18[H01L]
9917039 Method of forming a semiconductor package with conductive interconnect frame and structureApr 20, 16Mar 13, 18[H01L]
9917063 Semiconductor package structure for improving die warpage and manufacturing method thereofJul 30, 14Mar 13, 18[H01L]
9911685 Land structure for semiconductor package and method thereforFeb 14, 16Mar 06, 18[H01L]
9905440 Method of manufacturing an electronic device and electronic device manufactured therebyAug 26, 16Feb 27, 18[H01L]
9892990 Semiconductor package lid thermal interface material standoffsJul 24, 14Feb 13, 18[H01L]
9881864 Method for fabricating semiconductor package and semiconductor package using the sameApr 03, 17Jan 30, 18[H01L]
9875980 Copper pillar sidewall protectionMay 23, 14Jan 23, 18[H01L]
9870985 Semiconductor package with clip alignment notchJul 11, 16Jan 16, 18[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0323,863 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOFAbandonedMay 09, 16Nov 09, 17[H01L]
2017/0194,239 A SEMICONDUCTOR PACKAGE HAVING AN ETCHED GROOVE FOR AN EMBEDDED DEVICE FORMED ON BOTTOM SURFACE OF A SUPPORT SUBSTRATE AND A METHOD FOR FABRICATING THE SAMEAbandonedMay 09, 16Jul 06, 17[H01L]
2017/0162,519 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOFAbandonedMay 09, 16Jun 08, 17[H01L]
2015/0303,170 SINGULATED UNIT SUBSTRATE FOR A SEMICONDCUTOR DEVICEAbandonedApr 17, 14Oct 22, 15[H01L]
2015/0255,426 SEMICONDUCTOR DEVICE WITH REDUCED WARPAGEAbandonedNov 18, 14Sep 10, 15[H01L]
2015/0221,570 THIN SANDWICH EMBEDDED PACKAGEAbandonedFeb 04, 14Aug 06, 15[H01L]
2015/0041,980 Semiconductor Package with Reduced ThicknessAbandonedAug 06, 14Feb 12, 15[H01L]
2015/0021,767 SEMICONDUCTOR DEVICE WITH PLATED CONDUCTIVE PILLAR COUPLINGAbandonedOct 25, 13Jan 22, 15[H01L]
2014/0162,407 Method And System For Semiconductor PackagingAbandonedDec 10, 12Jun 12, 14[H01L]
2014/0124,926 Method And System For A Chaser Pellet In A Semiconductor Package Mold ProcessAbandonedNov 07, 12May 08, 14[H01L]
2011/0115,918 Camera module having lens mount with ir filterAbandonedJan 18, 11May 19, 11[H04N]
7556986 Tape supported memory card leadframe structureExpiredJun 21, 06Jul 07, 09[H01L]
2009/0021,921 Memory card and its manufacturing methodAbandonedApr 26, 05Jan 22, 09[H05K]
2008/0283,979 Semiconductor Package Having Reduced ThicknessAbandonedNov 29, 07Nov 20, 08[H01L, H05K]
2008/0237,824 Stacked electronic component package having single-sided film spacerAbandonedFeb 17, 06Oct 02, 08[H01L]
2008/0106,624 Method of using a camera moduleAbandonedDec 21, 07May 08, 08[H01L, H04N]
2008/0043,447 Semiconductor package having laser-embedded terminalsAbandonedJul 14, 05Feb 21, 08[H05K]
2008/0003,722 Transfer mold solution for molded multi-media cardAbandonedApr 15, 04Jan 03, 08[H01L]
2007/0272,827 Image sensor package having mount holder attached to image sensor dieAbandonedApr 27, 05Nov 29, 07[H01J, H01L]
2007/0270,040 Chamfered Memory CardAbandonedMay 05, 06Nov 22, 07[H01R]

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