AMKOR TECHNOLOGY, INC.

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 84758
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 9469
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1776
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 16117
 
  
 
G06K RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS 15183
 
  
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 12116
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 11148
 
  
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 11194
 
  
 
B81B MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES 924
 
  
 
H01K ELECTRIC INCANDESCENT LAMPS 913

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0047,692 Method and System for Packing Optimization of Semiconductor DevicesAug 10, 16Feb 15, 18[H01L]
2017/0200,686 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOFMay 06, 16Jul 13, 17[H01L]
2017/0200,782 CAPACITOR OF SEMICONDUCTOR INTEGRATED CIRCUIT AND METHOD FOR MANUFACTURING THE SAMEMay 06, 16Jul 13, 17[H01L]
2017/0162,535 TRANSIENT INTERFACE GRADIENT BONDING FOR METAL BONDSDec 08, 15Jun 08, 17[H01L]
2017/0154,861 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOFFeb 10, 17Jun 01, 17[H01L]
2017/0141,046 SEMICONDUCTOR DEVICE WITH AN ELECTROMAGNETIC INTERFERENCE (EMI) SHIELDMay 09, 16May 18, 17[H01L]
2017/0133,310 SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOFJan 06, 17May 11, 17[H01L]
2017/0133,334 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOFNov 09, 15May 11, 17[H01L]
2017/0117,214 SEMICONDUCTOR DEVICE WITH THROUGH-MOLD VIADec 26, 16Apr 27, 17[H01L]
2016/0343,593 SEMICONDUCTOR PACKAGE INCLUDING PREMOLD AND METHOD OF MANUFACTURING THE SAMEJul 05, 16Nov 24, 16[H01L]

View all Publication..

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9922919 Electronic package structure having insulated substrate with lands and conductive patternsDec 30, 15Mar 20, 18[H01L]
9916989 System and method for laser assisted bonding of semiconductor dieApr 15, 16Mar 13, 18[H01L]
9917039 Method of forming a semiconductor package with conductive interconnect frame and structureApr 20, 16Mar 13, 18[H01L]
9917063 Semiconductor package structure for improving die warpage and manufacturing method thereofJul 30, 14Mar 13, 18[H01L]
9911685 Land structure for semiconductor package and method thereforFeb 14, 16Mar 06, 18[H01L]
9905440 Method of manufacturing an electronic device and electronic device manufactured therebyAug 26, 16Feb 27, 18[H01L]
9892990 Semiconductor package lid thermal interface material standoffsJul 24, 14Feb 13, 18[H01L]
9881864 Method for fabricating semiconductor package and semiconductor package using the sameApr 03, 17Jan 30, 18[H01L]
9875980 Copper pillar sidewall protectionMay 23, 14Jan 23, 18[H01L]
9870985 Semiconductor package with clip alignment notchJul 11, 16Jan 16, 18[H01L]

View all patents..

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2017/0323,863 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOFAbandonedMay 09, 16Nov 09, 17[H01L]
2017/0194,239 A SEMICONDUCTOR PACKAGE HAVING AN ETCHED GROOVE FOR AN EMBEDDED DEVICE FORMED ON BOTTOM SURFACE OF A SUPPORT SUBSTRATE AND A METHOD FOR FABRICATING THE SAMEAbandonedMay 09, 16Jul 06, 17[H01L]
2017/0162,519 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOFAbandonedMay 09, 16Jun 08, 17[H01L]
2015/0303,170 SINGULATED UNIT SUBSTRATE FOR A SEMICONDCUTOR DEVICEAbandonedApr 17, 14Oct 22, 15[H01L]
2015/0255,426 SEMICONDUCTOR DEVICE WITH REDUCED WARPAGEAbandonedNov 18, 14Sep 10, 15[H01L]
2015/0221,570 THIN SANDWICH EMBEDDED PACKAGEAbandonedFeb 04, 14Aug 06, 15[H01L]
2015/0041,980 Semiconductor Package with Reduced ThicknessAbandonedAug 06, 14Feb 12, 15[H01L]
2015/0021,767 SEMICONDUCTOR DEVICE WITH PLATED CONDUCTIVE PILLAR COUPLINGAbandonedOct 25, 13Jan 22, 15[H01L]
2014/0162,407 Method And System For Semiconductor PackagingAbandonedDec 10, 12Jun 12, 14[H01L]
2014/0124,926 Method And System For A Chaser Pellet In A Semiconductor Package Mold ProcessAbandonedNov 07, 12May 08, 14[H01L]
2011/0115,918 Camera module having lens mount with ir filterAbandonedJan 18, 11May 19, 11[H04N]
7556986 Tape supported memory card leadframe structureExpiredJun 21, 06Jul 07, 09[H01L]
2009/0021,921 Memory card and its manufacturing methodAbandonedApr 26, 05Jan 22, 09[H05K]
2008/0283,979 Semiconductor Package Having Reduced ThicknessAbandonedNov 29, 07Nov 20, 08[H01L, H05K]
2008/0237,824 Stacked electronic component package having single-sided film spacerAbandonedFeb 17, 06Oct 02, 08[H01L]
2008/0106,624 Method of using a camera moduleAbandonedDec 21, 07May 08, 08[H01L, H04N]
2008/0043,447 Semiconductor package having laser-embedded terminalsAbandonedJul 14, 05Feb 21, 08[H05K]
2008/0003,722 Transfer mold solution for molded multi-media cardAbandonedApr 15, 04Jan 03, 08[H01L]
2007/0272,827 Image sensor package having mount holder attached to image sensor dieAbandonedApr 27, 05Nov 29, 07[H01J, H01L]
2007/0270,040 Chamfered Memory CardAbandonedMay 05, 06Nov 22, 07[H01R]

View all patents..

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.