AMP-AKZO CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 186
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 1100

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
5385787 Organosilane adhesion promotion in manufacture of additive printed wiring boardFeb 03, 93Jan 31, 95[B05D]
5258200 Electroless copper depositionAug 04, 92Nov 02, 93[C23C]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
5358825 Manufacture of printed circuit conductors by a partially additive processExpiredMar 24, 93Oct 25, 94[G03C, H05K]
5256441 Ductile copperExpiredAug 04, 92Oct 26, 93[C23C]
5059242 Seed layer compositions containing organogold and organosilver compoundsExpiredApr 27, 90Oct 22, 91[C23C]
5008619 Multilevel circuit board precision positioningExpiredNov 18, 88Apr 16, 91[G01B, H05K]
4954185 Method of applying adherent coating on copperExpiredJul 07, 88Sep 04, 90[C23C]
4927742 Multilayer printed wiring boardsExpiredNov 23, 88May 22, 90[G03C]
4919752 Bath solution and process for the removal of lead/tim, lead or tin coatings from copper or nickel surfacesExpiredNov 10, 88Apr 24, 90[C03C, C23F, B44C]
4804575 Multilayer printed wiring boardsExpiredJan 14, 87Feb 14, 89[C08F, B32B, H05K]
4774279 Adherent coating for copperExpiredJan 14, 87Sep 27, 88[C08L]
4770067 Method of manufacturing surgical cutting tools for thermally aided surgeryExpiredJun 08, 87Sep 13, 88[B21K]
4770788 Process for removing metal complexes from waste solutionsExpiredApr 25, 85Sep 13, 88[C02F]
4751105 Method for producing circuit boardsExpiredDec 07, 83Jun 14, 88[B05D]
4750092 Interconnection package suitable for electronic devices and methods for producing sameExpiredOct 20, 86Jun 07, 88[H05K]
4701352 Surface preparation of ceramic substrates for metallizationExpiredDec 10, 84Oct 20, 87[B05D]
4683036 Method for electroplating non-metallic surfacesExpiredNov 21, 85Jul 28, 87[C25D]
4672007 Electrodeposition composition and process for providing a Zn/Si/P coating on metal substratesExpiredJul 10, 85Jun 09, 87[C25D, B32B]
4666744 Process for avoiding blister formation in electroless metallization of ceramic substratesExpiredDec 10, 84May 19, 87[B05D]
4662944 Process and composition for sensitizing articles for metallizationExpiredDec 22, 76May 05, 87[C23C]
4663000 Process for electro-deposition of a ductile strongly adhesive zinc coating for metalsExpiredJul 25, 85May 05, 87[C25D]
4647477 Surface preparation of ceramic substrates for metallizationExpiredDec 07, 84Mar 03, 87[C23C]

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