APROLASE DEVELOPMENT CO., LLC

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 5357
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 3153
 
  
 
G06F ELECTRIC DIGITAL DATA PROCESSING 1446
 
  
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 1127
 
  
 
H04B TRANSMISSION 1209
 
  
 
H05B ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR 1110

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
5688721 3D stack of IC chips having leads reached by vias through passivation covering access planeMar 26, 96Nov 18, 97[H01L]
5635010 Dry adhesive joining of layers of electronic devicesApr 14, 95Jun 03, 97[H05K]
5508836 Infrared wireless communication between electronic system componentsSep 13, 94Apr 16, 96[H04B]
5432318 Apparatus for segmenting stacked IC chipsJan 07, 94Jul 11, 95[H05B]
5432729 Electronic module comprising a stack of IC chips each interacting with an IC chip secured to the stackJun 08, 94Jul 11, 95[H01L]
5424920 Non-conductive end layer for integrated stack of IC chipsApr 25, 94Jun 13, 95[H05K]
5406701 Fabrication of dense parallel solder bump connectionsSep 13, 93Apr 18, 95[H05K]
5304790 Apparatus and system for controllably varying image resolution to reduce data outputOct 05, 92Apr 19, 94[H01J]
5279991 Method for fabricating stacks of IC chips by segmenting a larger stackDec 24, 92Jan 18, 94[H01L]
5235672 Hardware for electronic neural networkFeb 06, 91Aug 10, 93[H01L, G06F]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2012/0027,620 FORCED VIBRATION PIEZO GENERATOR AND PIEZO ACTUATORAbandonedOct 06, 11Feb 02, 12[H02N, F04B]
2011/0271,523 BALL GRID ARRAY STACKAbandonedJul 18, 11Nov 10, 11[H05K]
2010/0291,735 STACKABLE SEMICONDUCTOR CHIP LAYER COMPRISING PREFABRICATED TRENCH INTERCONNECT VIASAbandonedJul 27, 10Nov 18, 10[H01L]
7777321 Stacked microelectronic layer and module with three-axis channel T-connectsExpiredOct 25, 05Aug 17, 10[H01L]
7714426 Ball grid array package format layers and structureExpiredJul 07, 07May 11, 10[H01L]
7709943 Stacked ball grid array package module utilizing one or more interposer layersExpiredFeb 08, 06May 04, 10[H01L]
2010/0009,499 STACKED MICROELECTRONIC LAYER AND MODULE WITH THREE-AXIS CHANNEL T-CONNECTSAbandonedSep 18, 09Jan 14, 10[H01L]
7235785 Imaging device with multiple fields of view incorporating memory-based temperature compensation of an uncooled focal plane arrayExpiredJan 31, 05Jun 26, 07[G01J]
2007/0052,084 High density interconnect assembly comprising stacked electronic moduleAbandonedAug 04, 06Mar 08, 07[H01L]
7180579 Three-dimensional imaging processing module incorporating stacked layers containing microelectronic circuitsExpiredMar 22, 04Feb 20, 07[G01C]
7174627 Method of fabricating known good dies from packaged integrated circuitsExpiredJan 09, 03Feb 13, 07[H01R]
2006/0126,307 Cornerbond assembly comprising three-dimensional electronic modulesAbandonedDec 12, 05Jun 15, 06[H05K]
6998328 Method for creating neo-wafers from singulated integrated circuit die and a device made according to the methodExpiredNov 05, 03Feb 14, 06[H01L]
6993835 Method for electrical interconnection of angularly disposed conductive patternsExpiredDec 04, 03Feb 07, 06[H05K]
6912862 Cryopump piston position trackingExpiredJul 08, 03Jul 05, 05[F25B]
6891160 Method and apparatus for temperature compensation of an uncooled focal plane arrayExpiredOct 25, 02May 10, 05[G01J]
2004/0188,596 Three-dimensional imaging device incorporating stacked layers containing microelectronic circuitsAbandonedMar 22, 04Sep 30, 04[G09G]
2003/0221,313 Method for making stacked integrated circuits (ICs) using prepackaged partsAbandonedJan 09, 03Dec 04, 03[H01R, H01H, H05K]
2003/0049,889 Method of manufacturing multilayer modulesAbandonedSep 07, 01Mar 13, 03[H01L]
6476392 Method and apparatus for temperature compensation of an uncooled focal plane arrayExpiredMay 11, 01Nov 05, 02[G01J]

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