ARIMA OPTOELECTRONICS CORP.
Patent Owner
Stats
- 10 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- May 01, 2012 most recent publication
Details
- 10 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 827 Total Citation Count
- Aug 10, 1998 Earliest Filing
- 30 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
- No Recent Publications to Display
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
7781755 Light emitting diode by use of metal diffusion bonding technology and method of producing such light emitting diodeApr 23, 09Aug 24, 10[H01L]
7704770 Light emitting diode by use of metal diffusion bonding technology and method of producing light emitting diodeDec 11, 06Apr 27, 10[H01L]
7126825 Combined chip/heat-dissipating metal plate and method for manufacturing the sameDec 07, 04Oct 24, 06[H05K]
7061026 High brightness gallium nitride-based light emitting diode with transparent conducting oxide spreading layerApr 16, 04Jun 13, 06[H01L]
6614170 Light emitting diode with light conversion using scattering optical mediaFeb 26, 01Sep 02, 03[H01J]
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
8169086 Semiconductor chip pad structure and method for manufacturing the sameExpiredMar 30, 10May 01, 12[H01L]
2011/0241,059 LED DIE STRUCTURE AND METHOD FOR MANUFACTURING THE BOTTOM TERMINAL THEREOFAbandonedMar 30, 10Oct 06, 11[H01L]
7397182 Display module using blue-ray or ultraviolet-ray light sourcesExpiredJun 14, 05Jul 08, 08[H01J]
7291874 Laser dicing apparatus for a gallium arsenide wafer and method thereofExpiredAug 26, 05Nov 06, 07[H01L]
2006/0081,869 Flip-chip electrode light-emitting element formed by multilayer coatingsAbandonedOct 04, 05Apr 20, 06[H01L]
2005/0244,992 Method for manufacturing light emitting diode utilizing metal substrate and metal bonding technology and structure thereofAbandonedJul 07, 05Nov 03, 05[H01L]
2005/0173,710 Method for manufacturing light emitting diode utilizing transparent substrate and metal bonding technology and structure thereofAbandonedApr 11, 05Aug 11, 05[H01L]
2005/0093,427 Full-color light-emitting diode (LED) formed by overlaying red, green, and blue LED diode diesAbandonedJun 21, 04May 05, 05[H01J, H01L]
2005/0082,547 Light emitting device having a transparent conducting layerAbandonedAug 10, 04Apr 21, 05[H01L]
2005/0072,983 Method for manufacturing light emitting diode utilizing metal substrate and metal bonding technology and structure thereofAbandonedJun 17, 04Apr 07, 05[H01L]
2004/0206,963 Method for manufacturing light emitting diode utilizing transparent substrate and metal bonding technology and structure thereofAbandonedApr 14, 04Oct 21, 04[H01L]
2004/0043,524 Method for fabricating light emitting diode with transparent substrateAbandonedMay 22, 03Mar 04, 04[H01L]
6677903 Mobile communication device having multiple frequency band antennaExpiredDec 04, 01Jan 13, 04[H01Q]
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