ASM JAPAN K.K.

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 103260
 
 
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 4754
 
 
 
H05H PLASMA TECHNIQUE 1812
 
 
 
B65G TRANSPORT OR STORAGE DEVICES, e.g. CONVEYERS FOR LOADING OR TIPPING; SHOP CONVEYER SYSTEMS; PNEUMATIC TUBE CONVEYERS 859
 
 
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 828
 
 
 
B08B CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 652
 
 
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 582
 
 
 
B05C APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 441
 
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 4443
 
 
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 3125

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2013/0014,896 Wafer-Supporting Device and Method for Producing SameJul 15, 11Jan 17, 13[C23C, B05C, H01L, B05D]
2006/0151,002 Method of CVD chamber cleaningDec 22, 04Jul 13, 06[B08B, H05H]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9793148 Method for positioning wafers in multiple wafer transportJun 22, 11Oct 17, 17[H01L]
9312155 High-throughput semiconductor-processing apparatus equipped with multiple dual-chamber modulesJun 06, 11Apr 12, 16[B05C, H01L, G05B, B32B]
9171716 Method of forming metal oxide hardmaskOct 02, 14Oct 27, 15[H01L, G03F]
8901016 Method of forming metal oxide hardmaskDec 21, 11Dec 02, 14[H01L]
8845806 Shower plate having different aperture dimensions and/or distributionsOct 22, 10Sep 30, 14[C23C, H01J, H01L, C23F]
8765233 Method for forming low-carbon CVD film for filling trenchesDec 09, 08Jul 01, 14[C23C]
8758514 Cluster type semiconductor processing apparatusMar 02, 07Jun 24, 14[C23C, H01L]
8669185 Method of tailoring conformality of Si-containing filmJul 30, 10Mar 11, 14[C23C, H01L]
8666551 Semiconductor-processing apparatus equipped with robot diagnostic moduleDec 22, 08Mar 04, 14[H01L, B25J]
8647722 Method of forming insulation film using plasma treatment cyclesNov 13, 09Feb 11, 14[H05H]

View all patents..

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0068,970 UV Irradiation Apparatus Having UV Lamp-Shared Multiple Process StationsAbandonedSep 21, 11Mar 21, 13[H01L, B01J]
2013/0014,697 Container Having Multiple Compartments Containing Liquid Material for Multiple Wafer-Processing ChambersAbandonedJul 12, 11Jan 17, 13[C23C]
8129291 Method of depositing dielectric film having Si-N bonds by modified peald methodWithdrawnOct 08, 10Mar 06, 12[H01L]
2011/0159,202 Method for Sealing Pores at Surface of Dielectric Layer by UV Light-Assisted CVDAbandonedNov 24, 10Jun 30, 11[C08J]
2010/0189,923 METHOD OF FORMING HARDMASK BY PLASMA CVDAbandonedJan 29, 09Jul 29, 10[H05H]
2010/0147,396 Multiple-Substrate Transfer Apparatus and Multiple-Substrate Processing ApparatusAbandonedDec 15, 08Jun 17, 10[C23C, H01L, B08B]
2010/0151,151 METHOD OF FORMING LOW-K FILM HAVING CHEMICAL RESISTANCEAbandonedDec 11, 08Jun 17, 10[B05D]
2010/0136,313 PROCESS FOR FORMING HIGH RESISTIVITY THIN METALLIC FILMAbandonedDec 01, 08Jun 03, 10[C23C, C01B, B32B]
2010/0101,491 WAFER LIFT PINS SUSPENDED AND SUPPORTED AT UNDERSIDE OF SUSCEPTORAbandonedOct 29, 08Apr 29, 10[B05C]
2010/0104,770 TWO-STEP FORMATION OF HYDROCARBON-BASED POLYMER FILMAbandonedOct 27, 08Apr 29, 10[H05H]
2010/0085,129 IMPEDANCE MATCHING APPARATUS FOR PLASMA-ENHANCED REACTION REACTORAbandonedOct 06, 08Apr 08, 10[H03H]
2010/0014,945 SEMICONDUCTOR PROCESSING APPARATUS HAVING ALL-ROUND TYPE WAFER HANDLING CHAMBERAbandonedJul 16, 08Jan 21, 10[H01L]
2010/0006,025 EXHAUST GAS TRAP FOR SEMICONDUCTOR PROCESSESAbandonedJul 11, 08Jan 14, 10[B05C]
2010/0000,470 WAFER-POSITIONING MECHANISMAbandonedJul 02, 08Jan 07, 10[C23C]
2010/0003,833 METHOD OF FORMING FLUORINE-CONTAINING DIELECTRIC FILMAbandonedJul 01, 08Jan 07, 10[H01L]
2009/0297,731 APPARATUS AND METHOD FOR IMPROVING PRODUCTION THROUGHPUT IN CVD CHAMBERAbandonedMay 30, 08Dec 03, 09[C23C, H05H]
2009/0269,506 Method and apparatus for cleaning of a CVD reactorAbandonedApr 24, 08Oct 29, 09[C23C, B08B, C25F]
2009/0246,399 METHOD FOR ACTIVATING REACTIVE OXYGEN SPECIES FOR CLEANING CARBON-BASED FILM DEPOSITIONAbandonedMar 28, 08Oct 01, 09[C23C, B05C, B08B]
2009/0162,170 TANDEM TYPE SEMICONDUCTOR-PROCESSING APPARATUSAbandonedDec 19, 07Jun 25, 09[H01L]
2009/0155,488 SHOWER PLATE ELECTRODE FOR PLASMA CVD REACTORAbandonedDec 18, 07Jun 18, 09[C23C, B08B]

View all patents..

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.