AUSTRIA MIKRO SYSTEM INTERNATIONAL AG

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360
 
 
 
G01D MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED BY A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR 159
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 1158
 
 
 
G03F PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR 1103
 
 
 
G05F SYSTEMS FOR REGULATING ELECTRIC OR MAGNETIC VARIABLES 199

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
6727493 Multiple resolution photodiode sensor array for an optical encoderNov 06, 01Apr 27, 04[G01D]
6562547 Method for producing structure in chipsDec 01, 00May 13, 03[H01L, G03F]
6535053 Method for obtaining a temperature--independent voltage reference as well as a circuit arrangement for obtaining such a voltage referenceMar 12, 01Mar 18, 03[G05F]
6483301 Method for compensating mechanical stresses in measuring the magnetic field strength by hall sensorsMay 01, 01Nov 19, 02[H01L, G01R]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
6738394 Method, apparatus and protocol for the unidirectional and interference-safe transmission of digital data via radio wavesExpiredAug 17, 00May 18, 04[H04J]
6520014 Microsensor having a sensor device connected to an integrated circuit by a solder jointExpiredJun 02, 00Feb 18, 03[H01L, G01P]
6395585 Method for housing sensors in a packageExpiredMar 13, 01May 28, 02[G01N]
2001/0025,228 Method for evaluating measured dataAbandonedMar 21, 01Sep 27, 01[H03F]
6255190 Method for dielectrically isolated deep pn-junctions in silicon substrates using deep trench sidewall predeposition technologyExpiredJun 18, 98Jul 03, 01[H01L]

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