AVIZA EUROPE LIMITED

Patent Owner

Watch Compare Add to Portfolio

Stats

Details

Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 7355
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 299
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 186
 
  
 
H05H PLASMA TECHNIQUE 129

Top Patents (by citation)

Upgrade to the Professional Level to View Top Patents for this Owner. Learn More

Recent Publications

  • No Recent Publications to Display

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7378001 Magnetron sputteringJul 18, 01May 27, 08[C23C]
7279201 Methods and apparatus for forming precursorsApr 04, 02Oct 09, 07[C23C]
7205246 Forming low k dielectric layersNov 18, 02Apr 17, 07[H01L]
7202167 Method of forming a diffusion barrierSep 22, 04Apr 10, 07[H01L]
7199474 Damascene structure with integral etch stop layerJul 15, 02Apr 03, 07[H01L]
6653247 Dielectric layer for a semiconductor device and method of producing the sameAug 31, 01Nov 25, 03[H01L]
6649527 Method of etching a substrateMar 27, 02Nov 18, 03[H01L]
6475564 Deposition of a siloxane containing polymerJul 06, 00Nov 05, 02[H01L]
6468386 Gas delivery systemMar 03, 00Oct 22, 02[H05H]
5932289 Method for filling substrate recesses using pressure and heat treatmentApr 10, 97Aug 03, 99[B05D]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
6963137 Low dielectric constant layersExpiredJul 15, 02Nov 08, 05[H01L]
6846757 Dielectric layer for a semiconductor device and method of producing the sameExpiredAug 12, 03Jan 25, 05[H01L]
6824699 Method of treating an insulting layerExpiredMay 16, 03Nov 30, 04[C23F]
2004/0217,346 Method of deposting a dielectric filmAbandonedJan 27, 04Nov 04, 04[H01L]
2004/0188,241 Method of depositing aluminium nitrideAbandonedJan 07, 04Sep 30, 04[C23C]
2004/0180,538 Method for producing a copper connectionAbandonedJan 07, 04Sep 16, 04[H01L]
2004/0154,748 Electrostatic clamping of thin wafers in plasma processing vacuum chamberAbandonedJan 21, 04Aug 12, 04[C23C, H01L]
2004/0115,923 Method of filling a via or recess in a semiconductor substrateAbandonedSep 16, 03Jun 17, 04[H01L]
2004/0050,690 Magnetron sputtering apparatusAbandonedSep 16, 03Mar 18, 04[C23C]
6640840 Delivery of liquid precursors to semiconductor processing reactorsExpiredSep 21, 00Nov 04, 03[B65B]
6627535 Methods and apparatus for forming a film on a substrateExpiredJan 17, 01Sep 30, 03[H01L]
2003/0157,781 Method of filling trenchesAbandonedNov 08, 02Aug 21, 03[H01L]
6592770 Method of treating an isulating layerExpiredMay 11, 00Jul 15, 03[B44C]
2003/0024,808 Methods of sputtering using kryptonAbandonedAug 21, 02Feb 06, 03[C23C]
2001/0041,460 Method of depositing dielectricAbandonedApr 12, 01Nov 15, 01[H01L]
6274245 Foil for use in filing substrate recessesExpiredJun 23, 99Aug 14, 01[B32B]

Top Inventors for This Owner

Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More

We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!

We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.