Advanced Interconnect Solutions
Patent Owner
Stats
- 0 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Sep 12, 2006 most recent publication
Details
- 0 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 170 Total Citation Count
- Jun 07, 2000 Earliest Filing
- 5 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
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Recent Publications
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Recent Patents
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Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
7104804 Method and apparatus for memory module circuit interconnectionExpiredJul 25, 01Sep 12, 06[H01R]
2004/0040,855 Method for low-cost redistribution and under-bump metallization for flip-chip and wafer-level BGA silicon device packagesAbandonedAug 28, 02Mar 04, 04[C25D]
6534419 Method and apparatus for reducing IC die mass and thickness while improving strength characteristicsExpiredSep 13, 00Mar 18, 03[H07L]
6347947 Method and apparatus for protecting and strengthening electrical contact interfacesExpiredJul 26, 00Feb 19, 02[H01R]
6296169 Flux-application fixture for a ball-grid-array (BGA) assembly processExpiredJun 07, 00Oct 02, 01[B23K]
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