Advanced Laser Separation International B.V.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 192
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 1361

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7947920 Arrangement and method for forming one or more separated scores in a surface of a substrateOct 30, 06May 24, 11[H01L, B23K]
7682937 Method of treating a substrate, method of processing a substrate using a laser beam, and arrangementNov 25, 05Mar 23, 10[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2008/0113,493 Method, Device and Diffraction Grating for Separating Semiconductor Elements Formed on a Substrate by Altering Said Diffraction GratingAbandonedDec 29, 04May 15, 08[H01L]

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