BEIJING NMC CO., LTD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 13349
 
  
 
C23C COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL 1190
 
  
 
H01J ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS 10118
 
  
 
B08B CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL 157
 
  
 
B81C PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS 131
 
  
 
H03F AMPLIFIERS 182

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0011,938 REACTION CHAMBER AND PLASMA PROCESSING APPARATUSDec 03, 14Jan 12, 17[H01J, H01L]
2016/0329,228 CASSETTE POSITIONING DEVICE AND SEMICONDUCTOR PROCESSING APPARATUSNov 27, 14Nov 10, 16[H01L]
2015/0284,846 TRAY DEVICE, REACTION CHAMBER AND MOCVD APPARATUSNov 12, 13Oct 08, 15[C23C]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9728379 Plasma processing apparatusSep 03, 09Aug 08, 17[C23C, H01J, H01L]
9540732 Plasma processing equipment and gas distribution apparatus thereofJul 23, 14Jan 10, 17[C23C, H01J, H01L]
9478439 Substrate etching methodNov 01, 13Oct 25, 16[H01L, B81C]
9399817 Magnetron source, magnetron sputtering apparatus and magnetron sputtering methodSep 30, 11Jul 26, 16[C23C, H01J]
9187319 Substrate etching method and substrate processing deviceJun 04, 12Nov 17, 15[H01L, B81C]
8888949 Plasma processing equipment and gas distribution apparatus thereofJan 09, 09Nov 18, 14[C23C, H01J, H01L]
8546910 Semiconductor structure and method for manufacturing the sameAug 24, 11Oct 01, 13[H01L]
8547021 Plasma processing apparatusOct 20, 09Oct 01, 13[H01J]
8466013 Method for manufacturing a semiconductor structureAug 25, 11Jun 18, 13[H01L]
8217579 Device and method for controlling DC bias of RF discharge systemFeb 03, 08Jul 10, 12[H05B, H03F]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0256,119 METHOD FOR APPLYING POWER TO TARGET MATERIAL, POWER SUPPLY FOR TARGET MATERIAL, AND SEMICONDUCTOR PROCESSING APPARATUSAbandonedDec 17, 10Oct 03, 13[C23C]
2013/0204,352 LONGITUDINALLY FLEXIBLE EXPANDABLE STENTAbandonedMar 14, 13Aug 08, 13[A61F]
2012/0313,149 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAMEAbandonedAug 25, 11Dec 13, 12[H01L]
2012/0313,158 SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAMEAbandonedAug 25, 11Dec 13, 12[H01L, B82Y]
2012/0200,981 ELECTROSTATIC CHUCK AND METHOD FOR REMOVING REMAINING CHARGES THEREONAbandonedAug 19, 10Aug 09, 12[H01L, H05F]
2012/0138,228 DEEP-TRENCH SILICON ETCHING AND GAS INLET SYSTEM THEREOFAbandonedAug 19, 10Jun 07, 12[B05B, F03B]
2010/0294,433 PLASMA PROCESSING APPARATUSAbandonedDec 31, 08Nov 25, 10[C23C, C23F]

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