BRIDGE SEMICONDUCTOR CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 102261
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 10146
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 1158
 
  
 
H02J CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY 1119

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0040,531 METHOD OF MAKING INTERCONNECT SUBSTRATE HAVING ROUTING CIRCUITRY CONNECTED TO POSTS AND TERMINALSOct 16, 17Feb 08, 18[H01L]
2017/0301,617 LEADFRAME SUBSTRATE WITH ISOLATOR INCORPORATED THEREIN AND SEMICONDUCTOR ASSEMBLY AND MANUFACTURING METHOD THEREOFJul 05, 17Oct 19, 17[H01L, H05K]
2017/0263,546 WIRING BOARD WITH ELECTRICAL ISOLATOR AND BASE BOARD INCORPORATED THEREIN AND SEMICONDUCTOR ASSEMBLY AND MANUFACTURING METHOD THEREOFMay 25, 17Sep 14, 17[H01L]
2017/0243,803 THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHOD OF MAKING THE SAMEMay 10, 17Aug 24, 17[H01L]
2017/0194,300 THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHOD OF MAKING THE SAMEMar 17, 17Jul 06, 17[H01L]
2017/0133,352 THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHOD OF MAKING THE SAMEJan 25, 17May 11, 17[H01L]
2017/0133,353 SEMICONDUCTOR ASSEMBLY WITH THREE DIMENSIONAL INTEGRATION AND METHOD OF MAKING THE SAMEJan 25, 17May 11, 17[H01L]
2017/0034,923 METHODS OF MAKING STACKABLE WIRING BOARD HAVING ELECTRONIC COMPONENT IN DIELECTRIC RECESSDec 03, 15Feb 02, 17[H05K]
2017/0025,393 THERMALLY ENHANCED FACE-TO-FACE SEMICONDUCTOR ASSEMBLY WITH HEAT SPREADER AND METHOD OF MAKING THE SAMEOct 08, 16Jan 26, 17[H01L]
2016/0211,207 SEMICONDUCTOR ASSEMBLY HAVING WIRING BOARD WITH ELECTRICAL ISOLATOR AND MOISTURE INHIBITING CAP INCORPORATED THEREIN AND METHOD OF MAKING WIRING BOARDMar 24, 16Jul 21, 16[H01L]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9913385 Methods of making stackable wiring board having electronic component in dielectric recessDec 03, 15Mar 06, 18[H05K]
9825009 Interconnect substrate having cavity for stackable semiconductor assembly, manufacturing method thereof and vertically stacked semiconductor assembly using the sameAug 25, 16Nov 21, 17[H01L]
9640518 Semiconductor package with package-on-package stacking capability and method of manufacturing the sameMar 11, 16May 02, 17[H01L]
9570372 Thermally enhanced semiconductor assembly with heat spreader and integrated dual build-up circuitries and method of making the sameMar 24, 16Feb 14, 17[H01L]
9349711 Semiconductor device with face-to-face chips on interposer and method of manufacturing the sameApr 17, 15May 24, 16[H01L]
9318411 Semiconductor package with package-on-package stacking capability and method of manufacturing the sameOct 14, 14Apr 19, 16[H01L]
9299651 Semiconductor assembly and method of manufacturing the sameNov 17, 14Mar 29, 16[H01L]
9230901 Semiconductor device having chip embedded in heat spreader and electrically connected to interposer and method of manufacturing the sameFeb 18, 15Jan 05, 16[H01L]
9209154 Semiconductor package with package-on-package stacking capability and method of manufacturing the sameDec 03, 14Dec 08, 15[H01L]
9147587 Interconnect substrate with embedded semiconductor device and built-in stopper and method of making the sameJan 10, 13Sep 29, 15[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0254,220 LOW WARPING CORELESS SUBSTRATE AND SEMICONDUCTOR ASSEMBLY USING THE SAMEAbandonedFeb 18, 16Sep 01, 16[H01L, H05K]
2016/0204,056 WIRING BOARD WITH INTERPOSER AND DUAL WIRING STRUCTURES INTEGRATED TOGETHER AND METHOD OF MAKING THE SAMEAbandonedJan 12, 16Jul 14, 16[H01L]
2016/0205,778 WIRING BOARD WITH EMBEDDED INTERPOSER INTEGRATED WITH STIFFENER AND METHOD OF MAKING THE SAMEAbandonedJan 14, 16Jul 14, 16[H01L, H05K]
2016/0174,365 WIRING BOARD WITH DUAL WIRING STRUCTURES INTEGRATED TOGETHER AND METHOD OF MAKING THE SAMEAbandonedJun 22, 15Jun 16, 16[H05K]
2015/0115,433 SEMICONDUCOR DEVICE AND METHOD OF MANUFACTURING THE SAMEAbandonedAug 01, 14Apr 30, 15[H01L]
2014/0291,001 METHOD OF MAKING HYBRID WIRING BOARD WITH BUILT-IN STIFFENER AND INTERPOSER AND HYBRID WIRING BOARD MANUFACTURED THEREBYAbandonedMay 07, 13Oct 02, 14[H05K]
2014/0251,658 THERMALLY ENHANCED WIRING BOARD WITH BUILT-IN HEAT SINK AND BUILD-UP CIRCUITRYAbandonedMar 07, 13Sep 11, 14[H05K]
2014/0246,227 METHOD OF MAKING CAVITY SUBSTRATE WITH BUILT-IN STIFFENER AND CAVITY SUBSTRATE MANUFACTURED THEREBYAbandonedMar 01, 13Sep 04, 14[H05K]
2014/0183,752 SEMICONDUCTOR ASSEMBLY WITH BUILT-IN STOPPER, SEMICONDUCTOR DEVICE AND BUILD-UP CIRCUITRY AND METHOD OF MAKING THE SAMEAbandonedJan 03, 13Jul 03, 14[H01L]
2014/0175,633 THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH EMBEDDED CHIP AND INTERPOSER AND METHOD OF MANUFACTURING THE SAMEAbandonedFeb 26, 14Jun 26, 14[H01L]
2014/0157,593 METHOD OF MAKING HYBRID WIRING BOARD WITH BUILT-IN STOPPER, INTERPOSER AND BUILD-UP CIRCUITRYAbandonedJan 30, 13Jun 12, 14[H05K]
2014/0061,877 WIRING BOARD WITH EMBEDDED DEVICE, BUILT-IN STOPPER AND ELECTROMAGNETIC SHIELDINGAbandonedOct 02, 13Mar 06, 14[H01L]
2014/0048,914 WIRING BOARD WITH EMBEDDED DEVICE AND ELECTROMAGNETIC SHIELDINGAbandonedAug 19, 13Feb 20, 14[H01L]
2014/0048,950 THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH EMBEDDED SEMICONDUCTOR DEVICE AND BUILT-IN STOPPER AND METHOD OF MAKING THE SAMEAbandonedJan 30, 13Feb 20, 14[H01L]
2014/0048,951 SEMICONDUCTOR ASSEMBLY WITH DUAL CONNECTING CHANNELS BETWEEN INTERPOSER AND CORELESS SUBSTRATEAbandonedJun 14, 13Feb 20, 14[H01L]
2014/0048,955 SEMICONDUCTOR ASSEMBLY BOARD WITH BACK-TO-BACK EMBEDDED SEMICONDUCTOR DEVICES AND BUILT-IN STOPPERSAbandonedOct 25, 13Feb 20, 14[H01L]
2014/0048,313 THERMALLY ENHANCED WIRING BOARD WITH THERMAL PAD AND ELECTRICAL POSTAbandonedAug 08, 13Feb 20, 14[H05K]
2014/0048,319 WIRING BOARD WITH HYBRID CORE AND DUAL BUILD-UP CIRCUITRIESAbandonedAug 09, 13Feb 20, 14[H05K]
2014/0048,326 MULTI-CAVITY WIRING BOARD FOR SEMICONDUCTOR ASSEMBLY WITH INTERNAL ELECTROMAGNETIC SHIELDINGAbandonedAug 09, 13Feb 20, 14[H05K]
8614502 Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic deviceExpiredApr 26, 12Dec 24, 13[H01L]

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