Bedford Engineering Co.
Patent Owner
Stats
- 0 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Dec 23, 1986 most recent publication
Details
- 0 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 80 Total Citation Count
- Jun 07, 1979 Earliest Filing
- 7 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
- No Technology to Display
Top Patents (by citation)
Upgrade to the Professional Level to View Top Patents for this Owner. Learn More |
Recent Publications
- No Recent Publications to Display
Recent Patents
- No Recent Patents to Display
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
4586651 Mailing sub-assembly with envelope sheet and enclosure sheetExpiredApr 18, 85May 06, 86[B65D]
4531993 High speed method of making envelopes each with a double folded removable enclosureExpiredJan 26, 84Jul 30, 85[B65B]
4530731 High speed method of making envelopes each with a separate enclosureExpiredJan 05, 84Jul 23, 85[B65B]
Top Inventors for This Owner
Upgrade to the Professional Level to View Top Inventors for this Owner. Learn More |
We are sorry but your current selection exceeds the maximum number of comparisons () for this membership level. Upgrade to our Level for up to -1 comparisons!
We are sorry but your current selection exceeds the maximum number of portfolios (0) for this membership level. Upgrade to our Level for up to -1 portfolios!.