CAESAR TECHNOLOGY, INC.

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
6236567 Electronic device package with enhanced heat dissipation effectExpiredDec 03, 99May 22, 01[H05K]
6087586 Chip scale packageExpiredApr 07, 98Jul 11, 00[H01L]
6068129 Indicating adhesion status between substrate and encapsulant of a packaged electronic deviceExpiredNov 02, 98May 30, 00[B65D]
5982621 Electronic device cooling arrangementExpiredNov 23, 98Nov 09, 99[H05K]
5946787 Method of repairing a substrate arrayExpiredDec 17, 97Sep 07, 99[H01L]

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