CARSEM (M) SDN. BHD.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 13349
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 192

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9691688 Thin plastic leadless package with exposed metal die paddleOct 26, 15Jun 27, 17[H01L]
9640517 Stacked electronic packagesOct 29, 14May 02, 17[H01L]
9190385 Thin plastic leadless package with exposed metal die paddleOct 30, 07Nov 17, 15[H01L]
8513819 Low loop wire bondingJul 31, 12Aug 20, 13[H01L]
8314479 Leadframe package with recessed cavity for LEDMay 24, 11Nov 20, 12[H01L, H01R]
8071470 Wafer level package using stud bump coated with solderMay 29, 09Dec 06, 11[H01L]
7846774 Multiple row exposed leads for MLP high density packagesAug 18, 06Dec 07, 10[H01L]
7351611 Method of making the mould for encapsulating a leadframe packageJun 15, 04Apr 01, 08[H01L]
7288833 Stress-free lead frameDec 23, 04Oct 30, 07[H01L]
7273767 Method of manufacturing a cavity packageMay 04, 05Sep 25, 07[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0200,503 PROTECTIVE LAYERS IN SEMICONDUCTOR PACKAGINGAbandonedJul 31, 12Aug 08, 13[H01L]
7214562 Method for encapsulating lead frame packagesExpiredFeb 25, 05May 08, 07[H01L]
2005/0167,790 Integrated circuit package with transparent encapsulant and method for making thereofAbandonedDec 29, 04Aug 04, 05[H01L]
6867483 Stress-free lead frameExpiredJul 20, 01Mar 15, 05[H01L]
6544817 Method for sawing a moulded leadframe packageExpiredJun 22, 01Apr 08, 03[H01L]

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