CASANTRA ACQUISITION III LLC

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM2155
 
  
 
G01P MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT 156
 
  
 
H01C RESISTORS127
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
5527627 Ink composition for an ultra-thick thick film for thermal management of a hybrid circuitNov 21, 94Jun 18, 96[B32B]
5527999 Multilayer conductor for printed circuitsFeb 21, 95Jun 18, 96[H05K]
5456109 Thick film rotational accelerometer having two structurally integrated linear acceleration sensorsMar 29, 93Oct 10, 95[G01P]
5395679 Ultra-thick thick films for thermal management and current carrying capabilities in hybrid circuitsMar 29, 93Mar 07, 95[B32B]
5164698 Post-termination apparatus and process for thick film resistors of printed circuit boardsJul 01, 91Nov 17, 92[H01C]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
6531663 Solder stop for an electrical connection and method thereforExpiredJan 30, 98Mar 11, 03[H05K]
6391678 Method for controlling solderability of a conductor and conductor formed therebyExpiredJun 28, 99May 21, 02[H01L]
6362435 Multi-layer conductor pad for reducing solder voidingExpiredDec 20, 99Mar 26, 02[H05K]
6328914 Thick-film paste with insoluble additiveExpiredJan 29, 99Dec 11, 01[H01B, H01C]
6007867 Method of manufacturing a thick film circuit with improved dielectric feature definitionExpiredJun 29, 98Dec 28, 99[B05D]
5169679 Post-termination apparatus and process for thick film resistors of printed circuit boardsExpiredOct 11, 88Dec 08, 92[C23C]
5151777 Interface device for thermally coupling an integrated circuit to a heat sinkExpiredOct 16, 89Sep 29, 92[H01L]

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