CASCADE MICROTECH, INC.

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Technologies

Intl Class Technology # of Patents/ App Rank in Class
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 13841
 
 
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 8110
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 4130
 
 
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 3170
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 3296
 
 
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 2169
 
 
 
H01P WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE 250
 
 
 
H04N PICTORIAL COMMUNICATION, e.g. TELEVISION 2204
 
 
 
B23B TURNING; BORING 142
 
 
 
B23Q DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING 133

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2014/0239,991 METHOD FOR VERIFYING A TEST SUBSTRATE IN A PROBER UNDER DEFINED THERMAL CONDITIONSApr 02, 14Aug 28, 14[G01R]
2014/0184,003 SYSTEMS AND METHODS FOR ROTATIONAL ALIGNMENT OF A DEVICE UNDER TESTDec 27, 13Jul 03, 14[G01R, H02K]
2014/0185,649 SYSTEMS AND METHODS FOR HANDLING SUBSTRATES AT BELOW DEW POINT TEMPERATURESDec 27, 13Jul 03, 14[G01N]
2014/0186,145 SYSTEMS AND METHODS FOR PROVIDING WAFER ACCESS IN A WAFER PROCESSING SYSTEMDec 27, 13Jul 03, 14[H01L]
2014/0145,743 MODULAR PROBER AND METHOD FOR OPERATING SAMESep 02, 11May 29, 14[G01R]
2014/0125,363 SYSTEMS AND METHODS FOR TESTING ELECTRONIC DEVICES THAT INCLUDE LOW POWER OUTPUT DRIVERSNov 04, 13May 08, 14[G01R]
2014/0028,337 METHOD FOR TESTING A TEST SUBSTRATE UNDER DEFINED THERMAL CONDITIONS AND THERMALLY CONDITIONABLE PROBERJul 29, 13Jan 30, 14[G01R]
2013/0321,018 MEMBRANE PROBING METHOD USING IMPROVED CONTACTMay 23, 13Dec 05, 13[G01R]
2013/0220,513 REPLACEABLE COUPON FOR A PROBING APPARATUSApr 01, 13Aug 29, 13[G01R, B32B]
2013/0183,898 SYSTEMS AND METHODS FOR NON-CONTACT POWER AND DATA TRANSFER IN ELECTRONIC DEVICESSep 16, 11Jul 18, 13[H04B]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8,841,932 Prober for testing devices in a repeat structure on a substrateApr 26, 11Sep 23, 14[G01R]
8,823,406 Systems and methods for simultaneous optical testing of a plurality of devices under testOct 17, 11Sep 02, 14[G01R, G01J]
8,680,879 Chuck for supporting and retaining a test substrate and a calibration substrateAug 12, 11Mar 25, 14[G01R]
8,497,693 Method for testing a test substrate under defined thermal conditions and thermally conditionable proberOct 01, 08Jul 30, 13[G01R]
8,451,017 Membrane probing method using improved contactJun 18, 10May 28, 13[G01R, H01R]
8,410,806 Replaceable coupon for a probing apparatusNov 20, 09Apr 02, 13[G01R]
8,402,848 Probe holderOct 10, 08Mar 26, 13[G01N]
8,344,744 Probe station for on-wafer-measurement under EMI-shieldingJun 18, 10Jan 01, 13[G01R]
8,319,503 Test apparatus for measuring a characteristic of a device under testNov 16, 09Nov 27, 12[G01R]
8,278,951 Probe station for testing semiconductor substrates and comprising EMI shieldingNov 15, 07Oct 02, 12[G01R]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Filing Date Issue/Pub Date Intl Class
2013/0321,018 MEMBRANE PROBING METHOD USING IMPROVED CONTACTMay 23, 13Dec 05, 13[G01R]
2011/0181,710 ARRANGEMENT AND METHOD FOR IMAGE ACQUISITION ON A PROBERJul 30, 10Jul 28, 11[H04N]
2011/0178,752 LINE-REFLECT-REFLECT MATCH CALIBRATIONMar 11, 11Jul 21, 11[G06F]
2010/0264,948 DIFFERENTIAL SIGNAL PROBING SYSTEMJun 16, 10Oct 21, 10[G01R]
2010/0251,545 WAFER PROBEJun 18, 10Oct 07, 10[H01R]
2010/0253,377 ACTIVE WAFER PROBEJun 16, 10Oct 07, 10[G01R]
2010/0244,874 TEST STRUCTURE AND PROBE FOR DIFFERENTIAL SIGNALSJun 16, 10Sep 30, 10[G01R]
7,768,271 Method for calibration of a vectorial network analyzer having more than two portsNov 19, 07Aug 03, 10[G01R]
7,769,555 Method for calibration of a vectorial network analyzerNov 19, 07Aug 03, 10[G01D]
7,761,983 Method of assembling a wafer probeOct 18, 07Jul 27, 10[H01R, H05K]
7,764,072 Differential signal probing systemFeb 22, 07Jul 27, 10[G01R]
7,759,953 Active wafer probeAug 14, 08Jul 20, 10[G01R]
7,723,999 Calibration structures for differential signal probingFeb 22, 07May 25, 10[G01R]
2010/0106,439 PROCESS FOR MEASURING THE IMPEDANCE OF ELECTRONIC CIRCUITSOct 30, 09Apr 29, 10[G01R]
7,688,062 Probe stationOct 18, 07Mar 30, 10[G01R]
7,688,091 Chuck with integrated wafer supportMar 10, 08Mar 30, 10[G01R]
2010/0045,264 PROBE FOR TEMPORARILY ELECTRICALLY CONTACTING A SOLAR CELLAug 11, 09Feb 25, 10[G01R]
2010/0045,265 METHOD AND DEVICE FOR FORMING A TEMPORARY ELECTRICAL CONTACT TO A SOLAR CELLAug 14, 09Feb 25, 10[G01R, H01R, H05K]
2010/0011,569 APPARATUS AND METHOD FOR ASSEMBLING SEVERAL SEMICONDUCTOR DEVICES ONTO A TARGET SUBSTRATEAug 27, 08Jan 21, 10[B23P]
2010/0001,742 Calibration techniqueJun 10, 09Jan 07, 10[G01R]

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