CASCADE MICROTECH, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 12651
 
 
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 8116
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 4321
 
 
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 3183
 
 
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 2186
 
 
 
H01P WAVEGUIDES; RESONATORS, LINES OR OTHER DEVICES OF THE WAVEGUIDE TYPE 252
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 2135
 
 
 
B23B TURNING; BORING 146
 
 
 
B23Q DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING 135
 
 
 
B25B TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING, OR HOLDING144

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2015/0301,082 RESILIENT ELECTRICAL INTERPOSERS, SYSTEMS THAT INCLUDE THE INTERPOSERS, AND METHODS FOR USING AND FORMING THE SAMEJun 30, 15Oct 22, 15[G01R]
2015/0255,322 WAFER-HANDLING END EFFECTORSFeb 25, 15Sep 10, 15[H01L, B25J]
2015/0241,472 SYSTEMS AND METHODS FOR ON-WAFER DYNAMIC TESTING OF ELECTRONIC DEVICESFeb 18, 15Aug 27, 15[G01R]
2015/0008,948 PROBER FOR TESTING DEVICES IN A REPEAT STRUCTURE ON A SUBSTRATESep 19, 14Jan 08, 15[G01R]
2014/0239,991 METHOD FOR VERIFYING A TEST SUBSTRATE IN A PROBER UNDER DEFINED THERMAL CONDITIONSApr 02, 14Aug 28, 14[G01R]
2014/0184,003 SYSTEMS AND METHODS FOR ROTATIONAL ALIGNMENT OF A DEVICE UNDER TESTDec 27, 13Jul 03, 14[G01R, H02K]
2014/0185,649 SYSTEMS AND METHODS FOR HANDLING SUBSTRATES AT BELOW DEW POINT TEMPERATURESDec 27, 13Jul 03, 14[G01N]
2014/0186,145 SYSTEMS AND METHODS FOR PROVIDING WAFER ACCESS IN A WAFER PROCESSING SYSTEMDec 27, 13Jul 03, 14[H01L]
2014/0125,363 SYSTEMS AND METHODS FOR TESTING ELECTRONIC DEVICES THAT INCLUDE LOW POWER OUTPUT DRIVERSNov 04, 13May 08, 14[G01R]
2014/0028,337 METHOD FOR TESTING A TEST SUBSTRATE UNDER DEFINED THERMAL CONDITIONS AND THERMALLY CONDITIONABLE PROBERJul 29, 13Jan 30, 14[G01R]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9,194,885 Modular prober and method for operating sameSep 02, 11Nov 24, 15[G01R]
9,110,131 Method and device for contacting a row of contact areas with probe tipsApr 13, 10Aug 18, 15[G01R]
9,099,449 Resilient electrical interposers, systems that include the interposers, and methods for using and forming the sameJan 08, 15Aug 04, 15[G01R, H01L]
8,970,240 Resilient electrical interposers, systems that include the interposers, and methods for using and forming the sameNov 02, 11Mar 03, 15[G01R]
8,922,229 Method for measurement of a power deviceJun 16, 10Dec 30, 14[G01R]
8,841,932 Prober for testing devices in a repeat structure on a substrateApr 26, 11Sep 23, 14[G01R]
8,823,406 Systems and methods for simultaneous optical testing of a plurality of devices under testOct 17, 11Sep 02, 14[G01R, G01J]
8,680,879 Chuck for supporting and retaining a test substrate and a calibration substrateAug 12, 11Mar 25, 14[G01R]
8,497,693 Method for testing a test substrate under defined thermal conditions and thermally conditionable proberOct 01, 08Jul 30, 13[G01R]
8,451,017 Membrane probing method using improved contactJun 18, 10May 28, 13[G01R, H01R]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0321,018 MEMBRANE PROBING METHOD USING IMPROVED CONTACTABANMay 23, 13Dec 05, 13[G01R]
2013/0069,680 RISERS INCLUDING A PLURALITY OF HIGH ASPECT RATIO ELECTRICAL CONDUITS AND SYSTEMS AND METHODS OF MANUFACTURE AND USE THEROFABANSep 11, 12Mar 21, 13[G01R, H05K]
2013/0015,871 SYSTEMS, DEVICES, AND METHODS FOR TWO-SIDED TESTING OF ELECTRONIC DEVICESABANJul 05, 12Jan 17, 13[G01R]
8,069,491 Probe testing structureExpiredJun 20, 07Nov 29, 11[G01Q]
2011/0181,710 ARRANGEMENT AND METHOD FOR IMAGE ACQUISITION ON A PROBERABANJul 30, 10Jul 28, 11[H04N]
2011/0178,752 LINE-REFLECT-REFLECT MATCH CALIBRATIONABANMar 11, 11Jul 21, 11[G06F]
7,898,273 Probe for testing a device under testExpiredFeb 17, 09Mar 01, 11[G01R]
7,876,114 Differential waveguide probeExpiredAug 07, 08Jan 25, 11[G01R, H01P]
7,876,115 Chuck for holding a device under testExpiredFeb 17, 09Jan 25, 11[G01R]
2010/0264,948 DIFFERENTIAL SIGNAL PROBING SYSTEMABANJun 16, 10Oct 21, 10[G01R]
2010/0251,545 WAFER PROBEABANJun 18, 10Oct 07, 10[H01R]
2010/0253,377 ACTIVE WAFER PROBEABANJun 16, 10Oct 07, 10[G01R]
2010/0244,874 TEST STRUCTURE AND PROBE FOR DIFFERENTIAL SIGNALSABANJun 16, 10Sep 30, 10[G01R]
7,768,271 Method for calibration of a vectorial network analyzer having more than two portsExpiredNov 19, 07Aug 03, 10[G01R]
7,769,555 Method for calibration of a vectorial network analyzerExpiredNov 19, 07Aug 03, 10[G01D]
7,761,983 Method of assembling a wafer probeExpiredOct 18, 07Jul 27, 10[H01R, H05K]
7,764,072 Differential signal probing systemExpiredFeb 22, 07Jul 27, 10[G01R]
7,759,953 Active wafer probeExpiredAug 14, 08Jul 20, 10[G01R]
7,723,999 Calibration structures for differential signal probingExpiredFeb 22, 07May 25, 10[G01R]
2010/0106,439 PROCESS FOR MEASURING THE IMPEDANCE OF ELECTRONIC CIRCUITSABANOct 30, 09Apr 29, 10[G01R]

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