Chip Pac, Inc.
Patent Owner
Stats
- 1 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Jan 16, 2007 most recent publication
Details
- 1 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 31 Total Citation Count
- Mar 13, 2006 Earliest Filing
- 0 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
- No Recent Publications to Display
Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
7163842 Method of fabricating a semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (BGA)Mar 13, 06Jan 16, 07[H01L]
Expired/Abandoned/Withdrawn Patents
- No Patents to Display
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