CHIPMOS TECHNOLOGIES INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 155212
 
  
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 9150
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 348
 
  
 
G06F ELECTRIC DIGITAL DATA PROCESSING 3444
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 3153
 
  
 
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 285
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 291
 
  
 
F16K VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING271
 
  
 
G08B SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS 292
 
  
 
B41J TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS 1101

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0061,811 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOFDec 09, 16Mar 01, 18[H01L]
2017/0331,006 SEMICONDCUTOR LIGHT-EMITTING DEVICE AND FABRICATING METHOD THEREOFOct 28, 16Nov 16, 17[H01L]
2016/0329,269 CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOFOct 05, 15Nov 10, 16[H01L]
2012/0018,883 CONDUCTIVE STRUCTURE FOR A SEMICONDUCTOR INTEGRATED CIRCUITSep 29, 11Jan 26, 12[H01L]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9865777 Semicondcutor light-emitting device and fabricating method thereofOct 28, 16Jan 09, 18[H01L]
9859239 Re-distribution layer structure and manufacturing method thereofMar 10, 17Jan 02, 18[H01L]
9847254 Fingerprint sensor chip package structure and manufacturing method thereofOct 12, 15Dec 19, 17[H01L, G06K]
9793229 Insulating protrusion in the trench of a re-distribution layer structureMar 10, 17Oct 17, 17[H01L]
9780056 Solder ball, manufacturing method thereof, and semiconductor deviceOct 19, 16Oct 03, 17[H01L]
9735092 Manufacturing method of chip package structureJun 20, 16Aug 15, 17[H01L]
9735132 Semiconductor packageNov 22, 16Aug 15, 17[H01L]
9728479 Multi-chip package structure, wafer level chip package structure and manufacturing process thereofSep 16, 15Aug 08, 17[H01L]
9721913 Semiconductor package and method of manufacturing thereofAug 18, 16Aug 01, 17[C23C, C25D, H01L, G02F]
9653429 Multi-chip package structure having blocking structure, wafer level chip package structure having blocking structure and manufacturing process thereofSep 16, 15May 16, 17[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2016/0308,100 SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THEREOFAbandonedApr 17, 15Oct 20, 16[H01L]
2016/0281,257 ELECTROCHEMICAL REACTION APPARATUSAbandonedSep 16, 15Sep 29, 16[C25D]
2016/0284,639 SEMICONDUCTOR STRUCTUREAbandonedSep 16, 15Sep 29, 16[H01L]
2016/0240,500 PACKAGED SEMICONDUCTOR DEVICESAbandonedSep 04, 15Aug 18, 16[H01L]
2015/0347,806 CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING CHIP PACKAGE STRUCTUREAbandonedSep 05, 14Dec 03, 15[H01L, G06K]
2015/0294,957 CHIP PACKAGING STRUCTUREAbandonedMar 20, 15Oct 15, 15[H01L]
2015/0279,771 SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOFAbandonedMar 09, 15Oct 01, 15[H01L]
2015/0232,325 MICRO ELECTRO MECHANICAL SYSTEMS PACKAGE AND MANUFACTURING METHOD THEREOFAbandonedJan 09, 15Aug 20, 15[B81C, B81B]
2015/0236,245 SEMICONDUCTOR PACKAGE AND METHOD THEREOFAbandonedNov 25, 14Aug 20, 15[H01L]
2015/0171,039 REDISTRIBUTION LAYER ALLOY STRUCTURE AND MANUFACTURING METHOD THEREOFAbandonedDec 13, 13Jun 18, 15[H01L]
2015/0130,084 PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAMEAbandonedApr 07, 14May 14, 15[H01L]
2015/0123,252 LEAD FRAME PACKAGE AND MANUFACTURING METHOD THEREOFAbandonedApr 09, 14May 07, 15[H01L]
2015/0076,670 CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOFAbandonedApr 18, 14Mar 19, 15[H01L]
2015/0053,752 BALL PLANTING DEVICE AND BALL PLANTING METHOD THEREOFAbandonedMay 22, 14Feb 26, 15[B23K]
2014/0061,880 WAFER LEVEL CHIP SCALE PACKAGEAbandonedJul 05, 13Mar 06, 14[H01L]
2014/0061,906 SEMICONDUCTOR STRUCTUREAbandonedApr 22, 13Mar 06, 14[H01L]
2013/0119,530 THERMALLY ENHANCED PACKAGING STRUCTUREAbandonedAug 17, 12May 16, 13[H01L]
2013/0069,228 FLIP-CHIP PACKAGE STRUCTURE AND FORMING METHOD THEREOFAbandonedJul 26, 12Mar 21, 13[H01L]
2013/0049,198 SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOFAbandonedFeb 06, 12Feb 28, 13[H01L]
2013/0049,787 METHOD OF TESTING STACKED SEMICONDUCTOR DEVICE STRUCTUREAbandonedApr 12, 12Feb 28, 13[G01R]

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