CHIPPAC, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 13349

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8129263 Wire bond interconnection and method of manufacture thereofJul 07, 11Mar 06, 12[H01L]
7691681 Chip scale package having flip chip interconnect on die paddleAug 14, 08Apr 06, 10[H01L]
7678611 Spacer die structure and method for attachingAug 15, 06Mar 16, 10[H01L]
7605480 Flip chip interconnection pad layoutMar 10, 06Oct 20, 09[H01L, H05K]
7420263 DBG system and method with adhesive layer severingMar 13, 06Sep 02, 08[H01L]
7407877 Self-coplanarity bumping shape for flip-chipJun 03, 05Aug 05, 08[H01L]
7372170 Flip chip interconnection pad layoutMar 10, 06May 13, 08[H01L]
7364946 Method of fabricating a semiconductor multi-package module having inverted land grid array (LGA) package stacked over ball grid array (BGA) packageJan 23, 07Apr 29, 08[H01L]
7358115 Method of fabricating a semiconductor assembly including chip scale package and second substrate with exposed substrate surfaces on upper and lower sidesJan 23, 07Apr 15, 08[H01L]
7211901 Self-coplanarity bumping shape for flip chipJun 03, 05May 01, 07[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2007/0013,060 Stacked Semiconductor Package having Adhesive/Spacer Structure and InsulationAbandonedSep 21, 06Jan 18, 07[H01L]
2006/0255,474 Packaging structure and methodAbandonedJun 01, 06Nov 16, 06[H01L]
2006/0192,275 Encapsulation method for semiconductor device having center padAbandonedNov 14, 05Aug 31, 06[H01L]
2006/0193,744 Lead-free solder systemAbandonedNov 14, 05Aug 31, 06[C22C]
2005/0269,692 Stacked semiconductor package having adhesive/spacer structure and insulationAbandonedMay 20, 05Dec 08, 05[H01L]
2005/0258,527 Adhesive/spacer island structure for multiple die packageAbandonedOct 20, 04Nov 24, 05[H01L]
2005/0258,545 Multiple die package with adhesive/spacer structure and insulated die surfaceAbandonedOct 20, 04Nov 24, 05[H01L]
2005/0224,919 Spacer die structure and method for attachingAbandonedOct 06, 04Oct 13, 05[H01L]
2005/0224,959 Die with discrete spacers and die spacing methodAbandonedOct 15, 04Oct 13, 05[H01L]
2005/0208,700 Die to substrate attach using printed adhesiveAbandonedOct 15, 04Sep 22, 05[H01L]
2005/0062,149 Integral heatsink ball grid arrayAbandonedOct 13, 04Mar 24, 05[H01L]
2005/0056,944 Super-thin high speed flip chip packageAbandonedOct 07, 04Mar 17, 05[H01L]
2004/0222,440 Chip scale package with flip chip interconnectAbandonedMay 04, 04Nov 11, 04[H01L]
2004/0070,080 Low cost, high performance flip chip package structureAbandonedJul 14, 03Apr 15, 04[H01L]
2004/0061,213 Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packagesAbandonedAug 02, 03Apr 01, 04[H01L]
2003/0205,197 Apparatus and process for precise encapsulation of flip chip interconnectsAbandonedJun 06, 03Nov 06, 03[B05C]
2003/0030,139 Integral heatsink plastic ball grid arrayAbandonedJun 26, 01Feb 13, 03[H01L]
2002/0121,707 Super-thin high speed flip chip packageAbandonedFeb 25, 02Sep 05, 02[H01L]
2002/0014,702 Packaging structure and methodAbandonedMar 09, 01Feb 07, 02[H01L]

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