CIRCUIT COMPONENTS, INCORPORATED
Patent Owner
Stats
- 3 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Feb 17, 1998 most recent publication
Details
- 3 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 1,802 Total Citation Count
- Oct 10, 1978 Earliest Filing
- 36 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
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Recent Patents
Patent #
Title
Filing Date
Issue Date
Intl Class
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
5272590 Integrated circuit package having an internal cavity for incorporating decoupling capacitorExpiredFeb 12, 90Dec 21, 93[H01G]
5034850 Thin decoupling capacitor for mounting under integrated circuit packageExpiredFeb 12, 90Jul 23, 91[H01G]
4994936 Molded integrated circuit package incorporating decoupling capacitorExpiredFeb 12, 90Feb 19, 91[H01L, H01G, H05K]
4989117 Molded integrated circuit package incorporating thin decoupling capacitorExpiredFeb 12, 90Jan 29, 91[H01L, H01G, H05K]
4754366 Decoupling capacitor for leadless surface mounted chip carrierExpiredMar 19, 87Jun 28, 88[H01G, H05K]
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