COVENTOR, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 10437
 
 
 
G01B MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS198
 
 
 
G06G ANALOGUE COMPUTERS 152
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 1361

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2017/0344,683 SYSTEM AND METHOD FOR ELECTRICAL BEHAVIOR MODELING IN A 3D VIRTUAL FABRICATION ENVIRONMENTMay 30, 17Nov 30, 17[G06F]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9659126 Modeling pattern dependent effects for a 3-D virtual semiconductor fabrication environmentJan 26, 15May 23, 17[G06F]
9317632 System and method for modeling epitaxial growth in a 3-D virtual fabrication environmentMar 14, 13Apr 19, 16[G06F]
9015016 System and method for three-dimensional schematic capture and result visualization of multi-physics system modelsNov 25, 08Apr 21, 15[G06F, G06G]
8959464 Multi-etch process using material-specific behavioral parameters in 3-D virtual fabrication environmentMar 14, 13Feb 17, 15[G06F]
8832620 Rule checks in 3-D virtual fabrication environmentMar 14, 13Sep 09, 14[G06F]
7272801 System and method for process-flexible MEMS design and simulationMar 12, 04Sep 18, 07[G06F]
7263674 System and method for three-dimensional visualization and postprocessing of a system modelDec 05, 03Aug 28, 07[G06F]
7131105 System and method for automatic mesh generation from a system-level MEMS designSep 19, 03Oct 31, 06[G06F]
6542829 Characterization of microelectromechanical structuresSep 21, 00Apr 01, 03[H01L, G01B]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2006/0173,658 System and method for numerically exploiting symmetry when using the boundary element method to perform computer-aided engineeringAbandonedJan 28, 05Aug 03, 06[G06F]
6540587 Infrared end-point detection systemExpiredOct 13, 00Apr 01, 03[B24B]
2003/0021,004 Method for fabricating a through-wafer optical MEMS device having an anti-reflective coatingAbandonedDec 19, 01Jan 30, 03[G02B]
2002/0181,838 Optical MEMS device and package having a light-transmissive opening or windowAbandonedDec 19, 01Dec 05, 02[G02B]
2002/0113,281 MEMS device having an actuator with curved electrodesAbandonedDec 19, 01Aug 22, 02[H01L]
2002/0114,058 Light-transmissive substrate for an optical MEMS deviceAbandonedDec 19, 01Aug 22, 02[G02B, G02F]
2002/0104,823 Fabrication integration of micro-componentsAbandonedJan 08, 02Aug 08, 02[B29D, G02B]
2002/0104,990 Across-wafer optical MEMS device and protective lid having across-wafer light-transmissive portionsAbandonedDec 19, 01Aug 08, 02[H01L]
2002/0086,456 Bulk micromachining process for fabricating an optical MEMS device with integrated optical apertureAbandonedDec 19, 01Jul 04, 02[H01L]

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