CUTEK RESEARCH, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 348
 
  
 
C25F PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR 216
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 1361

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
6077412 Rotating anode for a wafer processing chamberOct 30, 98Jun 20, 00[C25D, C25F]
6017437 Process chamber and method for depositing and/or removing material on a substrateAug 22, 97Jan 25, 00[C25D, C25F]
6017820 Integrated vacuum and plating cluster systemJul 17, 98Jan 25, 00[H01L]
5997712 Copper replenishment technique for precision copper plating systemMar 30, 98Dec 07, 99[C25D]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
6454864 Two-piece chuckExpiredJun 14, 99Sep 24, 02[C23C]
6365025 Method for depositing and/or removing material on a substrateExpiredNov 14, 00Apr 02, 02[C25D, C25F]
6241825 Compliant wafer chuckExpiredApr 16, 99Jun 05, 01[C23C]
6187152 Multiple station processing chamber and method for depositing and/or removing material on a substrateExpiredJul 17, 98Feb 13, 01[C25D, B05C, C25B]
6183611 Method and apparatus for the disposal of processing fluid used to deposit and/or remove material on a substrateExpiredJul 17, 98Feb 06, 01[C25B]
6179982 Introducing and reclaiming liquid in a wafer processing chamberExpiredOct 30, 98Jan 30, 01[C25D, C25F]
6022465 Apparatus and method utilizing an electrode adapter for customized contact placement on a waferExpiredJun 01, 98Feb 08, 00[C25D]

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