Clear Logic, Inc.

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
6531756 Laser fuse and antifuse structures formed over the active circuitry of an integrated circuitExpiredSep 27, 99Mar 11, 03[H01L]
6486527 Vertical fuse structure for integrated circuits containing an exposure window in the layer over the fuse structure to facilitate programming thereafterExpiredJun 25, 99Nov 26, 02[H01L]
2002/0100,958 Vertical fuse structure for integrated circuits and a method of disconnecting the sameAbandonedJan 28, 02Aug 01, 02[H01L]
6369437 Vertical fuse structure for integrated circuits and a method of disconnecting the sameExpiredJan 12, 99Apr 09, 02[H01L]
6348742 Sacrificial bond pads for laser configured integrated circuitsExpiredJan 25, 99Feb 19, 02[H01L, G09K, G01R]
6346748 Electronic circuit structure with photoresist layer that has non-precision openings formed by a laserExpiredMar 23, 99Feb 12, 02[H01L]
6311316 Designing integrated circuit gate arrays using programmable logic device bitstreamsExpiredDec 14, 98Oct 30, 01[H01L, G06F]
6239480 Modified lead frame for improved parallelism of a die to packageExpiredJul 06, 98May 29, 01[H01L]
6235556 Method of improving parallelism of a die to package using a modified lead frameExpiredSep 04, 98May 22, 01[H01L]
6228564 Method of patterning photoresist using precision and non-precision techniquesExpiredAug 18, 99May 08, 01[G03C]
6225652 Vertical laser fuse structure allowing increased packing densityExpiredAug 02, 99May 01, 01[H01L]
6191641 Zero power fuse circuit using subthreshold conductionExpiredFeb 23, 99Feb 20, 01[H01H]
6096566 Inter-conductive layer fuse for integrated circuitsExpiredApr 22, 98Aug 01, 00[H01L]
6087200 Using microspheres as a stress buffer for integrated circuit prototypesExpiredAug 13, 98Jul 11, 00[H01L]
6080533 Method of patterning photoresist using precision and non-precision techniquesExpiredMar 10, 98Jun 27, 00[G03F]
6078091 Inter-conductive layer fuse for integrated circuitsExpiredNov 04, 98Jun 20, 00[A01L]
6060330 Method of customizing integrated circuits by selective secondary deposition of interconnect materialExpiredApr 25, 97May 09, 00[H01L, G01R]
6020648 Die structure using microspheres as a stress buffer for integrated circuit prototypesExpiredDec 15, 98Feb 01, 00[H01L]
5989783 Method of customizing integrated circuits by depositing two resist layers to selectively pattern layer interconnect materialExpiredMar 12, 98Nov 23, 99[G03F]
5985518 Method of customizing integrated circuits using standard masks and targeting energy beamsExpiredMar 24, 97Nov 16, 99[G03F]

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