DENSE-PAC MICROSYSTEMS, INC.

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
6573461 Retaining ring interconnect used for 3-D stackingExpiredSep 20, 01Jun 03, 03[H01R, H05K]
2003/0085,455 Thermal ring used in 3-D stackingAbandonedNov 06, 01May 08, 03[H01L]
2003/0051,903 Retaining ring interconnect used for 3-D stackingAbandonedApr 08, 02Mar 20, 03[H05K]
2002/0089,831 Module with one side stacked memoryAbandonedJan 09, 01Jul 11, 02[H05K]
6180881 Chip stack and method of making sameExpiredMay 05, 98Jan 30, 01[H01L]
5313096 IC chip package having chip attached to and wire bonded within an overlying substrateExpiredJul 29, 92May 17, 94[H01L]
4956694 Integrated circuit chip stackingExpiredNov 04, 88Sep 11, 90[H01L]

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