DISCO CORPORATION

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 432110
 
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1579
 
 
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 979
 
 
 
B28D WORKING STONE OR STONE-LIKE MATERIALS 592
 
 
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 20186
 
 
 
B26D CUTTING; DETAILS COMMON TO MACHINES FOR SEVERING, e.g. BY CUTTING, PERFORATING, PUNCHING, STAMPING-OUT 1720
 
 
 
G03F PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR 1391
 
 
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM12145
 
 
 
H01S DEVICES USING STIMULATED EMISSION1280
 
 
 
B23Q DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING 1129

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0076,784 METHOD OF MANUFACTURING SURFACE ACOUSTIC WAVE DEVICE CHIPSAug 29, 17Mar 15, 18[H03H, H01L]
2018/0029,187 GRINDING APPARATUSJul 24, 17Feb 01, 18[B24B]
2018/0025,928 HOLD CHECKING METHOD AND UNHOLD CHECKING METHOD FOR WAFERJul 13, 17Jan 25, 18[H01J, H01L]
2018/0025,953 INSPECTING METHOD FOR INSPECTING INFLUENCE OF INSTALLATION ENVIRONMENT UPON PROCESSING APPARATUSJul 12, 17Jan 25, 18[G01R, B23K, H01L]
2018/0015,638 CUTTING APPARATUSJul 12, 17Jan 18, 18[B26D, B28D]
2018/0012,169 MANAGEMENT SYSTEM FOR SUPERVISING OPERATORJul 10, 17Jan 11, 18[H04N, G06Q, G06K]
2017/0368,659 PROCESSING APPARATUSJun 22, 17Dec 28, 17[B24B, B23B, B28D]
2017/0358,465 WAFER PROCESSING SYSTEMJun 08, 17Dec 14, 17[G05B, H01L]
2017/0341,179 LASER PROCESSING APPARATUS AND WAFER PRODUCING METHODMay 22, 17Nov 30, 17[B23K, H01L]
2017/0341,254 CUTTING APPARATUSMay 24, 17Nov 30, 17[B26D]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9901961 Cleaning apparatusDec 01, 14Feb 27, 18[B08B, H01L]
9905453 Protective sheeting for use in processing a semiconductor-sized wafer and semiconductor-sized wafer processing methodDec 29, 14Feb 27, 18[B81C, H01L]
9895768 Laser processing apparatusAug 31, 15Feb 20, 18[B23K]
9899262 Wafer processing methodAug 09, 16Feb 20, 18[H01L]
9892986 Packaged wafer manufacturing method and device chip manufacturing methodApr 07, 17Feb 13, 18[H01L]
9884389 SiC ingot slicing methodSep 10, 15Feb 06, 18[B23K, B28D, H01L]
9884390 Wafer producing methodDec 01, 15Feb 06, 18[B23K, B28D, H01L]
9887091 Wafer processing methodMay 05, 15Feb 06, 18[B24B, B44C, C23F, H01B, H01L, C03C]
9887140 Wafer processing methodApr 10, 17Feb 06, 18[H03H, H01L]
9878397 SiC wafer producing methodJan 03, 17Jan 30, 18[B23K, B28D, H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2018/0040,513 PROCESSING METHOD FOR WAFERAbandonedAug 05, 16Feb 08, 18[H01L]
2017/0212,425 EXPOSURE APPARATUSAbandonedJan 26, 17Jul 27, 17[G03F]
2016/0271,835 CUTTING APPARATUSAbandonedMar 17, 16Sep 22, 16[B23Q, B28D, H01L]
2016/0240,424 CHUCK TABLE OF PROCESSING APPARATUSAbandonedFeb 12, 16Aug 18, 16[H01L]
2016/0139,488 LASER OSCILLATION MECHANISMAbandonedNov 05, 15May 19, 16[H01S, G02B, G02F]
2015/0368,832 GaN SUBSTRATE, AND METHOD FOR MANUFACTURING GaN SUBSTRATEAbandonedFeb 06, 14Dec 24, 15[H01L, C30B]
2015/0357,242 WAFER PROCESSING METHODAbandonedJun 10, 15Dec 10, 15[H01L]
2015/0332,911 METHOD OF PROCESSING WAFERAbandonedMay 15, 15Nov 19, 15[B32B, H01L]
2015/0332,952 SUPPORT PLATE AND METHOD FOR FORMING SUPPORT PLATEAbandonedMay 15, 15Nov 19, 15[H01L]
2015/0303,113 WAFER PROCESSING METHODAbandonedApr 13, 15Oct 22, 15[H01L]
2015/0214,432 OPTICAL DEVICE AND MANUFACTURING METHOD THEREFORAbandonedJan 21, 15Jul 30, 15[H01L]
2015/0175,313 PACKAGING MATERIALAbandonedDec 20, 13Jun 25, 15[B65D]
2015/0170,969 DEVICE WAFER PROCESSING METHODAbandonedDec 05, 14Jun 18, 15[H01L]
2015/0093,882 WAFER PROCESSING METHODAbandonedSep 17, 14Apr 02, 15[H01L]
2015/0020,979 PEELING APPARATUS AND PEELING METHODAbandonedJul 16, 14Jan 22, 15[B32B]
2015/0001,548 LIGHT EMITTING CHIPAbandonedJun 26, 14Jan 01, 15[H01L]
2015/0001,714 STRESS-RESILIENT CHIP STRUCTURE AND DICING PROCESSAbandonedSep 12, 14Jan 01, 15[H01L]
2015/0000,776 FLOW ADJUSTING APPARATUSAbandonedJun 17, 14Jan 01, 15[F16K]
2014/0361,307 LIGHT EMITTING CHIPAbandonedJun 04, 14Dec 11, 14[H01L]
2014/0353,676 LIGHT EMITTING CHIPAbandonedMay 29, 14Dec 04, 14[H01L]

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