DISCO CORPORATION

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Technologies

Intl Class Technology # of Patents Rank
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 157121
 
 
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 6114
 
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 3832
 
 
 
B28D WORKING STONE OR STONE-LIKE MATERIALS 192
 
 
 
G03F PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR 878
 
 
 
G01B MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS772
 
 
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 7153
 
 
 
B26D CUTTING; DETAILS COMMON TO MACHINES FOR SEVERING, e.g. BY CUTTING, PERFORATING, PUNCHING, STAMPING-OUT 619
 
 
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 6132
 
 
 
G03B APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR 681

Top Patents (by citation)

Patent # Title Filing Date Issue Date Intl Class Cited #
6,433,917 Light modulation device and systemNov 22, 00Aug 13, 02[G02B]158
6,379,867 Moving exposure system and method for maskless lithography systemJan 10, 00Apr 30, 02[G03F]79
6,251,550 Maskless photolithography system that digitally shifts mask data responsive to alignment dataJul 07, 99Jun 26, 01[G03F]65
6,386,466 Cleaning apparatusApr 11, 00May 14, 02[B05B]45
6,257,224 Process for working a preform made of an oxide single crystal, and a process for producing functional devicesFeb 26, 98Jul 10, 01[B28D]42
6,473,237 Point array maskless lithographyMar 08, 01Oct 29, 02[G03B, G02B, G03F]41
6,344,402 Method of dicing workpieceJul 24, 00Feb 05, 02[H01L]41
6,509,955 Lens system for maskless photolithographyMay 16, 01Jan 21, 03[A61N, G03B, G03F]29
6,102,023 Precision cutting apparatus and cutting method using the sameJun 30, 98Aug 15, 00[B28D]28
6,537,738 System and method for making smooth diagonal components with a digital photolithography systemAug 08, 00Mar 25, 03[G03C]19

Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2013/0092,669 LASER PROCESSING APPARATUS INCLUDING PLASMA DETECTING MEANSOct 11, 12Apr 18, 13[B23K]
2013/0092,851 LIQUID LEVEL INDICATION DEVICEOct 03, 12Apr 18, 13[G01F]
2013/0087,947 ABLATION METHODOct 03, 12Apr 11, 13[B29C]
2013/0087,948 ABLATION METHOD FOR SUBSTRATE ON WHICH PASSIVATION FILM IS FORMEDOct 04, 12Apr 11, 13[B29C]
2013/0087,949 ABLATION METHOD FOR DIE ATTACH FILMOct 04, 12Apr 11, 13[B29C]
2013/0082,038 METHOD OF DETECTING CONDENSING SPOT POSITION IN LASER BEAM PROCESSING APPARATUSSep 14, 12Apr 04, 13[B23K]
2013/0082,358 SINGLE CRYSTAL SUBSTRATE WITH MULTILAYER FILM, MANUFACTURING METHOD FOR SINGLE CRYSTAL SUBSTRATE WITH MULTILAYER FILM, AND ELEMENT MANUFACTURING METHODMar 04, 11Apr 04, 13[H01L]
2013/0068,740 LASER PROCESSING APPARATUSSep 13, 12Mar 21, 13[B23K]
2013/0062,734 CRYSTALLINE FILM, DEVICE, AND MANUFACTURING METHODS FOR CRYSTALLINE FILM AND DEVICEMar 04, 11Mar 14, 13[H01L]
2013/0064,509 OPTICAL FIBER CONNECTORSep 09, 11Mar 14, 13[G02B]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8,431,428 Optical device wafer processing method and laser processing apparatusApr 19, 11Apr 30, 13[H01L]
8,431,861 Height position detecting apparatus and height position detecting methodAug 04, 09Apr 30, 13[B23K]
8,422,119 Compensation of beam walkoff in nonlinear crystal using cylindrical lensSep 20, 10Apr 16, 13[H01S, G02F]
8,415,232 Dividing method for wafer having die bonding film attached to the back side thereofOct 20, 11Apr 09, 13[H01L]
8,415,234 Wafer dividing methodMay 02, 12Apr 09, 13[H01L]
8,417,579 Method of managing partsJul 28, 11Apr 09, 13[G06Q]
8,409,969 Optical device wafer processing methodSep 01, 11Apr 02, 13[H01L]
8,404,999 Laser processing apparatusOct 07, 10Mar 26, 13[B23K]
8,389,386 Stacked wafer manufacturing methodApr 18, 11Mar 05, 13[H01L]
8,378,257 Laser processing apparatusNov 02, 09Feb 19, 13[B23K]

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Top Inventors for This Owner

Inventor Name Address # of Patent/Pub
Sekiya Kazuma
Tokyo, JP
106
Morikazu Hiroshi
Tokyo, JP
84
Nakamura Masaru
Tokyo, JP
65
Nomaru Keiji
Tokyo, JP
64
Nagai Yusuke
Tokyo, JP
47
Arai Kazuhisa
Tokyo, JP
38
Kobayashi Satoshi
Tokyo, JP
38
Morishige Yukio
Tokyo, JP
32
Hoshino Hitoshi
Tokyo, JP
26
Kajiyama Keiichi
Tokyo, JP
25