Domintech Co., Ltd.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
G01P MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT 156
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 1361

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
8664029 Process for fabricating a capacitance type tri-axial accelerometerExpiredOct 19, 09Mar 04, 14[H01L]
2013/0213,698 HOLDER FOR SEMICONDUCTOR PACKAGEAbandonedJul 03, 12Aug 22, 13[H05K]
8468888 MEMS sensor capable of sensing acceleration and pressureExpiredNov 22, 10Jun 25, 13[G01L, G01P]
8236605 Method for separating semiconductor wafer into chipsExpiredJul 19, 10Aug 07, 12[H01L]
2012/0056,280 MEMS Sensor PackageAbandonedOct 22, 10Mar 08, 12[H01L]
2011/0228,481 THERMALLY CONDUCTIVE INTERFACE MEANSAbandonedMar 19, 10Sep 22, 11[F28F, H05K]
2011/0140,210 MICROELECTROMECHANICAL SENSOR DEVICE PACKAGE AND METHOD FOR MAKING THE SAMEAbandonedJul 12, 10Jun 16, 11[H01L]
2011/0141,747 BULB FOR ELECTRIC LAMPAbandonedJan 27, 10Jun 16, 11[F21V, H01K]
2011/0127,191 METHOD OF PREVENTING ELECTRONIC COMPONENT FROM DAMAGE DURING TRANSPORTATION AND TRAYMADE BASED ON THE METHODAbandonedFeb 04, 10Jun 02, 11[B65D]
2010/0259,350 INDUCTOR OR TRANSFORMER FOR MICROELECTRIC SYSTEMAbandonedApr 01, 10Oct 14, 10[H01F]
2010/0175,912 IC PACKAGE HAVING COLORED PATTERNAbandonedApr 17, 09Jul 15, 10[H05K]
2010/0164,058 CHIP PACKAGE WITH STACKED INDUCTORSAbandonedApr 24, 09Jul 01, 10[H01L]
7274098 Chip packaging structure without leadframeExpiredAug 03, 05Sep 25, 07[H01L]
7187064 Electrical-interference-isolated transistor structureExpiredFeb 07, 05Mar 06, 07[H01L]
2006/0171,126 Memory card with memory chip replaceableAbandonedJun 20, 05Aug 03, 06[H05K]
2006/0131,742 PACKAGED CHIP CAPABLE OF LOWERING CHARACTERISTIC IMPEDANCEAbandonedFeb 15, 05Jun 22, 06[H01L]

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