DUPONT AIR PRODUCTS NANOMATERIALS LLC

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Patent Activity in the Last 10 Years

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Intl Class Technology Matters Rank in Class
 
  
 
C09K MATERIALS FOR APPLICATIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR392
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360
 
  
 
B24D TOOLS FOR GRINDING, BUFFING, OR SHARPENING 129
 
  
 
C09G POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH; SKI WAXES116

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7678702 CMP composition of boron surface-modified abrasive and nitro-substituted sulfonic acid and method of useAug 24, 06Mar 16, 10[H01L]
6635186 Chemical mechanical polishing composition and processJan 07, 99Oct 21, 03[H01L]
6313039 Chemical mechanical polishing composition and processJan 11, 00Nov 06, 01[C09K]
6251150 Slurry composition and method of chemical mechanical polishing using sameMay 27, 99Jun 26, 01[C09K, C09G]
6117783 Chemical mechanical polishing composition and processMar 23, 98Sep 12, 00[C09K]
5891205 Chemical mechanical polishing compositionAug 14, 97Apr 06, 99[B24D]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2010/0081,279 Method for Forming Through-base Wafer Vias in Fabrication of Stacked DevicesAbandonedSep 30, 08Apr 01, 10[H01L]
2009/0317,974 POLISHING COMPOSITION FOR SILICON WAFER, POLISHING COMPOSITION KIT FOR SILICON WAFER AND METHOD OF POLISHING SILICON WAFERAbandonedOct 18, 06Dec 24, 09[C09K, H01L]
2009/0311,947 Polishing Composition for Silicon Wafer and Polishing Method of Silicon WaferAbandonedOct 18, 06Dec 17, 09[B24B, C09K, H01L]
2009/0061,630 Method for Chemical Mechanical Planarization of A Metal-containing SubstrateAbandonedAug 21, 08Mar 05, 09[H01L]
2009/0029,553 Free radical-forming activator attached to solid and used to enhance CMP formulationsAbandonedSep 23, 08Jan 29, 09[C09K, H01L]
7419911 Compositions and methods for rapidly removing overfilled substratesExpiredNov 10, 04Sep 02, 08[B08B]
2008/0148,652 Compositions for chemical mechanical planarization of copperAbandonedDec 21, 06Jun 26, 08[B24B, C09C]
2008/0149,591 Method and slurry for reducing corrosion on tungsten during chemical mechanical polishingAbandonedDec 21, 06Jun 26, 08[C09K, B44C]
7351662 Composition and associated method for catalyzing removal rates of dielectric films during chemical mechanical planarizationExpiredSep 22, 05Apr 01, 08[H01L]
7316977 Chemical-mechanical planarization composition having ketooxime compounds and associated method for useExpiredAug 23, 06Jan 08, 08[H01L]
2007/0075,042 Stabilizer-Fenton's reaction metal-vinyl pyridine polymer-surface-modified chemical mechanical planarization composition and associated methodAbandonedSep 05, 06Apr 05, 07[C09K, C03C, H01L, C23F, B44C]
2006/0213,868 Low-dishing composition and method for chemical-mechanical planarization with branched-alkylphenol-substituted benzotriazoleAbandonedMar 14, 06Sep 28, 06[C09K, C03C, H01L]
2005/0215,183 Chemical-mechanical planarization composition having PVNO and associated method for useAbandonedApr 08, 05Sep 29, 05[B24B]
2005/0194,563 Bicine/tricine containing composition and method for chemical-mechanical planarizationAbandonedJan 10, 05Sep 08, 05[C09K, H01L, C23F, B44C]
2005/0126,588 Chemical mechanical polishing slurries and cleaners containing salicylic acid as a corrosion inhibitorAbandonedNov 04, 04Jun 16, 05[C23G]
2005/0079,803 Chemical-mechanical planarization composition having PVNO and associated method for useAbandonedOct 10, 03Apr 14, 05[B24B]
6866792 Compositions for chemical mechanical planarization of copperExpiredDec 12, 01Mar 15, 05[C09K]
2004/0161,938 Chemical-mechanical planarization using ozoneAbandonedFeb 19, 04Aug 19, 04[H01L]
2004/0144,038 Composition and associated method for oxide chemical mechanical planarizationAbandonedDec 08, 03Jul 29, 04[B24B]
2004/0134,873 Abrasive-free chemical mechanical polishing composition and polishing process containing sameAbandonedOct 21, 03Jul 15, 04[C23F]

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