DYCONEX AG

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 6150
 
  
 
C23F NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACES 333
 
  
 
H01K ELECTRIC INCANDESCENT LAMPS 319
 
  
 
A61B DIAGNOSIS; SURGERY; IDENTIFICATION 2238
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM2155
 
  
 
B44C PRODUCING DECORATIVE EFFECTS 232
 
  
 
A61N ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY 1106
 
  
 
B29C SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; AFTER- TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING 1124
 
  
 
G03C PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES 145
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 1361

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0076,155 Extremely High Frequency Electronic ComponentJul 31, 17Mar 15, 18[H01L, H01P]

Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9357968 Self-cleaning sensor surfaces for implantable sensor systemsJun 27, 11Jun 07, 16[A61B]
8677615 Method for embedding electrical componentsJul 08, 11Mar 25, 14[H05K]
8679010 Implantable sensor deviceJun 27, 11Mar 25, 14[A61B, G06F]
8509898 Electronic device or electric componentMay 13, 11Aug 13, 13[A61N]
6601297 Method for producing micro-openingsMar 26, 01Aug 05, 03[H01K]
6321443 Connection substrateMay 13, 98Nov 27, 01[H05K]
6293008 Method for producing foil circuit boardsJun 12, 00Sep 25, 01[H01K]
6218628 Foil circuit boards and semifinished products and method for the manufacture thereofJan 18, 96Apr 17, 01[H05K]
6162996 Insulating foil circuit board with rigid and flexible sectionsNov 21, 95Dec 19, 00[H05K]
5746929 Process for structuring polymer filmsAug 18, 97May 05, 98[C23F]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2015/0345,043 Method for Electrodeposition of an Electrode on a Dielectric SubstrateAbandonedAug 07, 15Dec 03, 15[C25D]
2012/0118,752 Method for Electrodeposition of an Electrode on a Dielectric SubstrateAbandonedOct 31, 11May 17, 12[C25D]
2012/0085,750 Covering Device for an Organic Substrate, Substrate with a Covering Device, and Method for Producing a Covering DeviceAbandonedAug 26, 11Apr 12, 12[B23K, B32B]
7892625 Method of fabricating an electrical connecting element, and an electrical connecting elementExpiredJul 20, 06Feb 22, 11[B21K, H01R]
7691276 Method for manufacturing an electrical connecting element, and a connecting elementExpiredMar 14, 06Apr 06, 10[H01B]
6954986 Method for fabricating electrical connecting elementExpiredMar 30, 01Oct 18, 05[H01K]
2004/0090,760 Electrical connecting element and method of fabricating the sameAbandonedNov 13, 02May 13, 04[H05K]
2003/0121,146 Method for fabricating electrical connecting elements, and connecting elementAbandonedNov 14, 02Jul 03, 03[H05K]
6486394 Process for producing connecting conductorsExpiredAug 16, 99Nov 26, 02[H01B]
5729897 Method of manufacturing multilayer foil printed circuit boardsExpiredMar 06, 95Mar 24, 98[H05K]
5651899 Structuring of printed circuit boardsExpiredSep 29, 95Jul 29, 97[B44C]
5457881 Method for the through plating of conductor foilsExpiredJan 25, 94Oct 17, 95[H01K]
5074037 Process for producing electrical connections on a universal substrateExpiredFeb 12, 90Dec 24, 91[H05K]

Top Inventors for This Owner

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