Draper Laboratory, Inc.

Patent Owner

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
 
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
5564181 Method of fabricating a laminated substrate assembly chips-first multichip moduleApr 18, 95Oct 15, 96[H05K]

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