ELECTRO SCIENTIFIC INDUSTRIES, INC.

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Technologies

Intl Class Technology # of Patents/ App Rank in Class
 
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1784
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 52268
 
 
 
H01S DEVICES USING STIMULATED EMISSION4353
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 36101
 
 
 
G01B MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS1768
 
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 15375
 
 
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 12167
 
 
 
G06K RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS 12160
 
 
 
G02F DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS 1199
 
 
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 9164

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2014/0340,507 METHOD OF MEASURING NARROW RECESSED FEATURES USING MACHINE VISIONMay 14, 14Nov 20, 14[H04N]
2014/0312,013 LASER EMISSION-BASED CONTROL OF BEAM POSITIONERMar 15, 14Oct 23, 14[B23K]
2014/0288,693 IMAGE RECOGNITION BASE ABLATION PATTERN POSITION RECALLMar 14, 14Sep 25, 14[G05B]
2014/0259,659 PHASED ARRAY STEERING FOR LASER BEAM POSITIONING SYSTEMSMar 14, 14Sep 18, 14[B23K, H05K]
2014/0263,201 LASER SYSTEMS AND METHODS FOR AOD ROUT PROCESSINGMar 14, 14Sep 18, 14[B23K]
2014/0263,212 COORDINATION OF BEAM ANGLE AND WORKPIECE MOVEMENT FOR TAPER CONTROLMar 11, 14Sep 18, 14[B23K]
2014/0263,223 LASER SYSTEMS AND METHODS FOR AOD TOOL SETTLING FOR AOD TRAVEL REDUCTIONMar 14, 14Sep 18, 14[B23K]
2014/0268,134 LASER SAMPLING METHODS FOR REDUCING THERMAL EFFECTSMar 13, 14Sep 18, 14[G01J]
2014/0256,205 SYSTEMS AND METHODS FOR PROVIDING POLARIZATION COMPENSATED MULTI-SPECTRAL LASER REPAIR OF LIQUID CRYSTAL DISPLAY PANELSMar 11, 13Sep 11, 14[H01J]
2014/0231,393 PROGRAM CONTROLLED DICING OF A SUBSTRATE USING A PULSED LASER BEAMSep 17, 13Aug 21, 14[B23K, H01L]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8,901,947 Probe out-of-position sensing for automated test equipmentSep 28, 12Dec 02, 14[G01R]
8,894,868 Substrate containing aperture and methods of forming the sameOct 06, 11Nov 25, 14[B44C, B23K, H01L]
8,878,095 Reducing back-reflection in laser micromachining systemsDec 17, 10Nov 04, 14[H01S, B23K]
8,879,064 Apparatus and method for transporting an aerosolDec 23, 11Nov 04, 14[G01N]
8,866,043 Method and apparatus for laser drilling holes with Gaussian pulsesJul 02, 12Oct 21, 14[B23K]
8,847,110 Laser processing of conductive linksJan 27, 12Sep 30, 14[B23K, H01L]
8,847,113 Laser processing systems and methods for beam dithering and skivingOct 24, 11Sep 30, 14[G02B, G02F, B23K, G06F, H01L]
8,809,734 Methods and systems for thermal-based laser processing a multi-material deviceJul 03, 12Aug 19, 14[B23K, H01L]
8,800,475 Etching a laser-cut semiconductor before dicing a die attach film (DAF) or other material layerMar 04, 14Aug 12, 14[B05C]
8,761,216 Method and apparatus for reliably laser marking articlesJan 11, 13Jun 24, 14[H01S]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Filing Date Issue/Pub Date Intl Class
2013/0146,418 SORTING APPARATUS AND METHOD OF SORTING COMPONENTSDec 09, 11Jun 13, 13[B65G]
2012/0264,238 PROGRAM CONTROLLED DICING OF A SUBSTRATE USING A PULSED LASER BEAMApr 17, 12Oct 18, 12[B23K, H01L]
2012/0208,349 Support for Wafer SingulationFeb 01, 07Aug 16, 12[B23B, H01L]
2012/0187,098 ENERGY EFFICIENT, LASER-BASED METHOD AND SYSTEM FOR PROCESSING TARGET MATERIALMar 12, 12Jul 26, 12[B23K]
2012/0175,652 METHOD AND APPARATUS FOR IMPROVED SINGULATION OF LIGHT EMITTING DEVICESJan 06, 11Jul 12, 12[B23K, H01L]
2012/0160,814 METHODS AND SYSTEMS FOR LINK PROCESSING USING LASER PULSES WITH OPTIMIZED TEMPORAL POWER PROFILES AND POLARIZATIONSDec 28, 10Jun 28, 12[B23K]
2012/0083,049 SYSTEM AND METHOD FOR LASER PROCESSING AT NON-CONSTANT VELOCITIESNov 23, 11Apr 05, 12[B23K, H01L]
2011/0243,163 WEDGE-FACETED NONLINEAR CRYSTAL FOR HARMONIC GENERATIONApr 02, 10Oct 06, 11[H01S, G02F]
2011/0220,595 High Strength, High Density Carrier PlateMay 24, 11Sep 15, 11[F16M]
2011/0210,103 SYSTEMS AND METHODS FOR PROCESSING SEMICONDUCTOR STRUCTURES USING LASER PULSES LATERALLY DISTRIBUTED IN A SCANNING WINDOWMay 10, 11Sep 01, 11[B23K]
2011/0210,105 LINK PROCESSING WITH HIGH SPEED BEAM DEFLECTIONDec 22, 10Sep 01, 11[B23K]
2011/0177,674 PROCESSING OF MULTILAYER SEMICONDUCTOR WAFERSMar 16, 09Jul 21, 11[G21G, H01L]
2011/0108,534 METHOD AND SYSTEM FOR HIGH-SPEED, PRECISE MICROMACHINING AN ARRAY OF DEVICESJan 11, 11May 12, 11[B23K]
2011/0029,124 PROGRAM CONTROLLED DICING OF A SUBSTRATE USING A PULSED LASER BEAMAug 13, 10Feb 03, 11[G05B]
2010/0252,959 METHOD FOR IMPROVED BRITTLE MATERIALS PROCESSINGMar 25, 10Oct 07, 10[B44C, B29C]
2010/0252,540 METHOD AND APPARATUS FOR BRITTLE MATERIALS PROCESSINGApr 02, 10Oct 07, 10[B23K]
2010/0243,617 PRINTED CIRCUIT BOARD VIA DRILLING STAGE ASSEMBLYMar 26, 09Sep 30, 10[B23B, B23K]
2010/0193,481 LASER CONSTRUCTED WITH MULTIPLE OUTPUT COUPLERS TO GENERATE MULTIPLE OUTPUT BEAMSNov 29, 05Aug 05, 10[B23K]
2010/0133,651 SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LATERALLY SPACED LASER BEAM SPOTS WITH JOINT VELOCITY PROFILINGDec 02, 09Jun 03, 10[H01L]
2010/0089,881 SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LATERALLY SPACED LASER BEAM SPOTS DELIVERING MULTIPLE BLOWSDec 15, 09Apr 15, 10[B23K]

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