ELECTRO SCIENTIFIC INDUSTRIES, INC.

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Technologies

Intl Class Technology # of Patents Rank
 
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1365
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 43226
 
 
 
H01S DEVICES USING STIMULATED EMISSION4050
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 27100
 
 
 
G01B MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS1762
 
 
 
G06K RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS 12137
 
 
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 10151
 
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 10315
 
 
 
G02F DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS 992
 
 
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 6132

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2014/0098,410 SYSTEMS AND METHODS FOR PROVIDING TEMPERATURE STABILITY OF ACOUSTO-OPTIC BEAM DEFLECTORS AND ACOUSTO-OPTIC MODULATORS DURING USEOct 18, 13Apr 10, 14[G02F]
2014/0091,069 ULTRASHORT LASER PULSE WAFER SCRIBINGDec 05, 13Apr 03, 14[B23K]
2014/0091,820 PROBE OUT-OF-POSITION SENSING FOR AUTOMATED TEST EQUIPMENTSep 28, 12Apr 03, 14[G01R]
2014/0093,693 METHOD AND APPARATUS FOR SEPARATION OF STRENGTHENED GLASS AND ARTICLES PRODUCED THEREBYDec 02, 13Apr 03, 14[C03B]
2014/0094,954 METHOD AND SYSTEM FOR ADAPTIVELY CONTROLLING A LASER-BASED MATERIAL PROCESSING PROCESS AND METHOD AND SYSTEM FOR QUALIFYING SAMEDec 02, 13Apr 03, 14[G05B]
2014/0083,983 METHOD AND APPARATUS FOR SEPARATION OF WORKPIECES AND ARTICLES PRODUCED THEREBYSep 20, 13Mar 27, 14[B23K]
2014/0083,986 METHOD AND APPARATUS FOR MACHINING A WORKPIECESep 20, 13Mar 27, 14[B23K]
2014/0084,039 METHOD AND APPARATUS FOR SEPARATING WORKPIECESSep 20, 13Mar 27, 14[B26F]
2014/0084,040 METHOD AND APPARATUS FOR SEPARATING WORKPIECESSep 20, 13Mar 27, 14[B26F]
2014/0026,351 METHOD AND APPARATUS FOR COLLECTING MATERIAL PRODUCED BY PROCESSING WORKPIECESJul 26, 12Jan 30, 14[A47L]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8,694,148 Tracking and marking specimens having defects formed during laser via drillingNov 14, 05Apr 08, 14[G01R, G06F]
8,686,739 Programmable gain trans-impedance amplifier overload recovery circuitNov 08, 11Apr 01, 14[G01R]
8,679,948 Method and apparatus for laser singulation of brittle materialsFeb 22, 13Mar 25, 14[B23K]
8,680,430 Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece featuresDec 08, 08Mar 25, 14[B23K]
8,673,741 Etching a laser-cut semiconductor before dicing a die attach film (DAF) or other material layerJun 24, 11Mar 18, 14[H01L]
8,664,589 Spectroscopy data display systems and methodsDec 29, 11Mar 04, 14[B01D]
8,666,530 Silicon etching control method and systemDec 16, 10Mar 04, 14[G06F]
8,648,277 Laser direct ablation with picosecond laser pulses at high pulse repetition frequenciesMar 31, 11Feb 11, 14[B23K]
8,642,918 Adaptive optic beamshaping in laser processing systemsJun 12, 12Feb 04, 14[B23K]
8,622,218 Method of preventing damage to miniature electronic components held by a component carrierSep 21, 12Jan 07, 14[B65D]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Filing Date Issue/Pub Date Intl Class
2011/0029,124 PROGRAM CONTROLLED DICING OF A SUBSTRATE USING A PULSED LASER BEAMAug 13, 10Feb 03, 11[G05B]
2010/0193,481 LASER CONSTRUCTED WITH MULTIPLE OUTPUT COUPLERS TO GENERATE MULTIPLE OUTPUT BEAMSNov 29, 05Aug 05, 10[B23K]
2010/0133,651 SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LATERALLY SPACED LASER BEAM SPOTS WITH JOINT VELOCITY PROFILINGDec 02, 09Jun 03, 10[H01L]
2010/0089,881 SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LATERALLY SPACED LASER BEAM SPOTS DELIVERING MULTIPLE BLOWSDec 15, 09Apr 15, 10[B23K]
2010/0084,662 SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LASER BEAM SPOTS OVERLAPPING LENGTHWISE ON A STRUCTUREDec 08, 09Apr 08, 10[B23K, H01L]
2010/0078,416 METHOD OF LASER MICRO-MACHINING STAINLESS STEEL WITH HIGH COSMETIC QUALITYSep 26, 08Apr 01, 10[B23K]
2010/0078,419 POST-LENS STEERING OF A LASER BEAM FOR MICRO-MACHINING APPLICATIONSSep 26, 08Apr 01, 10[B23K]
2009/0242,526 LASER MICROMACHINING THROUGH A PROTECTIVE MEMBERMar 26, 08Oct 01, 09[B23K]
2009/0155,935 BACK SIDE WAFER DICINGFeb 20, 09Jun 18, 09[H01L]
2009/0020,513 Laser Machining Apparatus and Method with a Vacuum Extracting System and at Least a First Containement Zone for Containing Deposition of Emitted Hazardous MaterialFeb 01, 07Jan 22, 09[B23K]
2009/0011,614 RECONFIGURABLE SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LASER BEAM SPOTSSep 15, 08Jan 08, 09[B23K, H01L]
2008/0316,504 Method and system for machine vision-based feature detection and mark verification in a workpiece or wafer marking systemOct 09, 06Dec 25, 08[G01B, G06F]
2008/0297,912 VARIO-ASTIGMATIC BEAM EXPANDERJun 01, 07Dec 04, 08[G02B]
7,420,995 Simultaneously mode-locked, Q-switched laserDec 05, 06Sep 02, 08[H01S]
2008/0203,071 LINK PROCESSING USING LASER PULSES WITH SPECIALLY TAILORED POWER PROFILESMar 20, 08Aug 28, 08[B23K]
2008/0129,306 Multi-Point, Multi-Parameter Data Acquisition For Multi-Layer Ceramic Capacitor TestingNov 30, 06Jun 05, 08[G01R]
2008/0124,816 Systems and methods for semiconductor structure processing using multiple laser beam spotsOct 30, 07May 29, 08[B23K, H01L]
2008/0105,664 ENERGY-EFFICIENT, LASER-BASED METHOD AND SYSTEM FOR PROCESSING TARGET MATERIALJan 04, 08May 08, 08[B23K]
2008/0094,640 Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method for controlling energy delivered to a target structureDec 21, 06Apr 24, 08[B23K, G01B]
2008/0073,438 Laser-based method and system for processing targeted surface material and article produced therebyMay 10, 07Mar 27, 08[G06K]

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