ELECTRO SCIENTIFIC INDUSTRIES, INC.

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Technologies

Intl Class Technology # of Patents/ App Rank in Class
 
 
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 1744
 
 
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 55249
 
 
 
H01S DEVICES USING STIMULATED EMISSION4551
 
 
 
G01R MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES 35107
 
 
 
G01B MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS1768
 
 
 
G06F ELECTRIC DIGITAL DATA PROCESSING 14365
 
 
 
G06K RECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS 12158
 
 
 
G02B OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS 11165
 
 
 
G02F DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH IS MODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THE DEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY, COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g. SWITCHING, GATING, MODULATING OR DEMODULATING; TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF; FREQUENCY-CHANGING; NON-LINEAR OPTICS; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS 10102
 
 
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 9162

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2014/0256,205 SYSTEMS AND METHODS FOR PROVIDING POLARIZATION COMPENSATED MULTI-SPECTRAL LASER REPAIR OF LIQUID CRYSTAL DISPLAY PANELSMar 11, 13Sep 11, 14[H01J]
2014/0231,393 PROGRAM CONTROLLED DICING OF A SUBSTRATE USING A PULSED LASER BEAMSep 17, 13Aug 21, 14[B23K, H01L]
2014/0223,991 IN-CHAMBER FLUID HANDLING SYSTEM AND METHODS HANDLING FLUIDS USING THE SAMEFeb 06, 14Aug 14, 14[G01N]
2014/0224,775 LASER ABLATION CELL AND INJECTOR SYSTEM FOR A COMPOSITIONAL ANALYSIS SYSTEMFeb 14, 14Aug 14, 14[H05H]
2014/0227,776 LASER ABLATION CELL AND TORCH SYSTEM FOR A COMPOSITIONAL ANALYSIS SYSTEMFeb 14, 14Aug 14, 14[G01N]
2014/0197,140 LASER PULSE ENERGY CONTROL SYSTEMS AND METHODSJan 09, 14Jul 17, 14[B23K]
2014/0190,875 SYSTEMS AND METHODS FOR HANDLING ELECTRICAL COMPONENTSJan 06, 14Jul 10, 14[B07C]
2014/0182,786 ETCHING A LASER-CUT SEMICONDUCTOR BEFORE DICING A DIE ATTACH FILM (DAF) OR OTHER MATERIAL LAYERMar 04, 14Jul 03, 14[H01L]
2014/0175,067 METHODS OF FORMING IMAGES BY LASER MICROMACHININGDec 19, 13Jun 26, 14[B23K]
2014/0138,727 METHOD AND APPARATUS FOR PROCESSING A WORKPIECE AND AN ARTICLE FORMED THEREBYNov 14, 13May 22, 14[H01L]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8,809,734 Methods and systems for thermal-based laser processing a multi-material deviceJul 03, 12Aug 19, 14[B23K, H01L]
8,800,475 Etching a laser-cut semiconductor before dicing a die attach film (DAF) or other material layerMar 04, 14Aug 12, 14[B05C]
8,761,216 Method and apparatus for reliably laser marking articlesJan 11, 13Jun 24, 14[H01S]
8,733,535 Shallow angle vertical rotary loader for electronic device testingJun 17, 11May 27, 14[B65G, B65B]
8,735,740 Method and apparatus for optically transparent via fillingMar 02, 11May 27, 14[H05K]
8,735,772 Method and apparatus for improved laser scribing of opto-electric devicesFeb 20, 11May 27, 14[B23K, H01L]
8,735,774 Force reaction compensation systemJul 28, 09May 27, 14[B23K]
8,729,404 Method and apparatus for optically transparent via fillingMar 02, 11May 20, 14[H05K]
8,729,427 Minimizing thermal effect during material removal using a laserMar 27, 09May 20, 14[B23K]
8,723,075 Laser machining of fired ceramic and other hard and/or thick materialsDec 14, 11May 13, 14[B23K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Filing Date Issue/Pub Date Intl Class
2012/0264,238 PROGRAM CONTROLLED DICING OF A SUBSTRATE USING A PULSED LASER BEAMApr 17, 12Oct 18, 12[B23K, H01L]
2012/0187,098 ENERGY EFFICIENT, LASER-BASED METHOD AND SYSTEM FOR PROCESSING TARGET MATERIALMar 12, 12Jul 26, 12[B23K]
2012/0175,652 METHOD AND APPARATUS FOR IMPROVED SINGULATION OF LIGHT EMITTING DEVICESJan 06, 11Jul 12, 12[B23K, H01L]
2012/0160,814 METHODS AND SYSTEMS FOR LINK PROCESSING USING LASER PULSES WITH OPTIMIZED TEMPORAL POWER PROFILES AND POLARIZATIONSDec 28, 10Jun 28, 12[B23K]
2012/0083,049 SYSTEM AND METHOD FOR LASER PROCESSING AT NON-CONSTANT VELOCITIESNov 23, 11Apr 05, 12[B23K, H01L]
2011/0243,163 WEDGE-FACETED NONLINEAR CRYSTAL FOR HARMONIC GENERATIONApr 02, 10Oct 06, 11[H01S, G02F]
2011/0220,595 High Strength, High Density Carrier PlateMay 24, 11Sep 15, 11[F16M]
2011/0210,103 SYSTEMS AND METHODS FOR PROCESSING SEMICONDUCTOR STRUCTURES USING LASER PULSES LATERALLY DISTRIBUTED IN A SCANNING WINDOWMay 10, 11Sep 01, 11[B23K]
2011/0108,534 METHOD AND SYSTEM FOR HIGH-SPEED, PRECISE MICROMACHINING AN ARRAY OF DEVICESJan 11, 11May 12, 11[B23K]
2011/0029,124 PROGRAM CONTROLLED DICING OF A SUBSTRATE USING A PULSED LASER BEAMAug 13, 10Feb 03, 11[G05B]
2010/0252,540 METHOD AND APPARATUS FOR BRITTLE MATERIALS PROCESSINGApr 02, 10Oct 07, 10[B23K]
2010/0193,481 LASER CONSTRUCTED WITH MULTIPLE OUTPUT COUPLERS TO GENERATE MULTIPLE OUTPUT BEAMSNov 29, 05Aug 05, 10[B23K]
2010/0133,651 SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LATERALLY SPACED LASER BEAM SPOTS WITH JOINT VELOCITY PROFILINGDec 02, 09Jun 03, 10[H01L]
2010/0089,881 SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LATERALLY SPACED LASER BEAM SPOTS DELIVERING MULTIPLE BLOWSDec 15, 09Apr 15, 10[B23K]
2010/0084,662 SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LASER BEAM SPOTS OVERLAPPING LENGTHWISE ON A STRUCTUREDec 08, 09Apr 08, 10[B23K, H01L]
2010/0078,416 METHOD OF LASER MICRO-MACHINING STAINLESS STEEL WITH HIGH COSMETIC QUALITYSep 26, 08Apr 01, 10[B23K]
2010/0078,419 POST-LENS STEERING OF A LASER BEAM FOR MICRO-MACHINING APPLICATIONSSep 26, 08Apr 01, 10[B23K]
2009/0312,859 MODIFYING ENTRY ANGLES ASSOCIATED WITH CIRCULAR TOOLING ACTIONS TO IMPROVE THROUGHPUT IN PART MACHININGJun 12, 09Dec 17, 09[G05B]
2009/0242,526 LASER MICROMACHINING THROUGH A PROTECTIVE MEMBERMar 26, 08Oct 01, 09[B23K]
2009/0155,935 BACK SIDE WAFER DICINGFeb 20, 09Jun 18, 09[H01L]

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