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ELECTRONICS PACKAGING SOLUTIONS, INC.
Patent Owner
Stats
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9
total patents issued
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15 Total Apps Published
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Aug 02, 2011 most recent publication
Details
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9 Issued Patents
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2 Issued in last 3 years
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1 Published in last 3 years
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185 Total Citation Count
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Mar 22, 2002 Earliest Filing
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0 Expired/Abandoned/Withdrawn Patents
Technologies
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 3254
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 2101
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL 167
E04C STRUCTURAL ELEMENTS; BUILDING MATERIALS 115
E06B FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES, OR LIKE ENCLOSURES, IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES 127
G06F ELECTRIC DIGITAL DATA PROCESSING 1299
Top Patents (by citation)
6,627,814 Hermetically sealed micro-device package with windowMar 22, 02Sep 30, 03[H05K]38 6,924,974 Hermetically sealed micro-device package using cold-gas dynamic spray material depositionFeb 16, 04Aug 02, 05[G06F]19 6,723,379 Hermetically sealed micro-device package using cold-gas dynamic spray material depositionApr 26, 02Apr 20, 04[B05D]19 6,962,834 Wafer-level hermetic micro-device packagesNov 14, 03Nov 08, 05[H01L]14 6,759,590 Hermetically sealed micro-device package with windowJul 30, 03Jul 06, 04[H05K]12 7,517,712 Wafer-level hermetic micro-device packagesNov 08, 05Apr 14, 09[H01L]9 7,238,546 Hermetically sealed micro-device package with windowJun 29, 04Jul 03, 07[H01L]5 7,832,177 Insulated glazing unitsMay 04, 06Nov 16, 10[E06B, E04C]1
Recent Publications
2010/0119,740 GLASS-TO-METAL BOND STRUCTUREOct 16, 09May 13, 10[E06B, B32B] 2009/0074,997 INSULATING GLASS UNIT HAVING MULTI-HEIGHT INTERNAL STANDOFFS AND VISIBLE DECORATIONSep 12, 08Mar 19, 09[E06B] 2009/0032,924 HERMETICALLY SEALED PACKAGE WITH WINDOWJul 03, 07Feb 05, 09[H01L] 2006/0191,215 INSULATED GLAZING UNITS AND METHODSMay 04, 06Aug 31, 06[E06B] 2006/0157,274 Wafer-level hermetic micro-device packagesNov 08, 05Jul 20, 06[H01L] 2005/0275,079 Wafer-level hermetic micro-device packagesMay 27, 05Dec 15, 05[H01L] 2005/0067,179 Hermetically sealed micro-device package with windowJun 29, 04Mar 31, 05[E06B, H01L] 2004/0187,437 Laminated strength-reinforced window assembliesMar 26, 04Sep 30, 04[E04C, B32B]
Recent Patents
7,989,040 Insulating glass unit having multi-height internal standoffs and visible decorationSep 12, 08Aug 02, 11[E04C, E06B] 7,832,177 Insulated glazing unitsMay 04, 06Nov 16, 10[E06B, E04C] 7,517,712 Wafer-level hermetic micro-device packagesNov 08, 05Apr 14, 09[H01L] 7,238,546 Hermetically sealed micro-device package with windowJun 29, 04Jul 03, 07[H01L] 6,962,834 Wafer-level hermetic micro-device packagesNov 14, 03Nov 08, 05[H01L] 6,924,974 Hermetically sealed micro-device package using cold-gas dynamic spray material depositionFeb 16, 04Aug 02, 05[G06F] 6,759,590 Hermetically sealed micro-device package with windowJul 30, 03Jul 06, 04[H05K] 6,723,379 Hermetically sealed micro-device package using cold-gas dynamic spray material depositionApr 26, 02Apr 20, 04[B05D] 6,627,814 Hermetically sealed micro-device package with windowMar 22, 02Sep 30, 03[H05K]
Top Inventors for This Owner
