ELECTRONICS PACKAGING SOLUTIONS, INC.
Patent Owner
Stats
- 3 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Aug 02, 2011 most recent publication
Details
- 3 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 783 Total Citation Count
- Mar 22, 2002 Earliest Filing
- 13 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
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Top Patents (by citation)
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Recent Publications
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Recent Patents
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Title
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Issue Date
Intl Class
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
6924974 Hermetically sealed micro-device package using cold-gas dynamic spray material depositionExpiredFeb 16, 04Aug 02, 05[G06F]
2004/0187,437 Laminated strength-reinforced window assembliesAbandonedMar 26, 04Sep 30, 04[E04C, B32B]
6723379 Hermetically sealed micro-device package using cold-gas dynamic spray material depositionExpiredApr 26, 02Apr 20, 04[B05D]
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