ENTORIAN TECHNOLOGIES L.P.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 1361
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 1155

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
6426549 Stackable flex circuit IC package and method of making sameNov 03, 00Jul 30, 02[H01L]
5377077 Ultra high density integrated circuit packages method and apparatusDec 17, 93Dec 27, 94[H05K]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2009/0309,214 Circuit Module Turbulence EnhancementAbandonedAug 24, 09Dec 17, 09[H01L, H05K]
2009/0300,912 Flex Circuit Apparatus and Method for Adding Capacitance while Conserving Circuit Board Surface AreaAbandonedAug 17, 09Dec 10, 09[H05K]
2009/0294,946 Package-Borne Selective Enablement StackingAbandonedMay 07, 09Dec 03, 09[H01L]
2009/0294,948 Contrast Interposer Stacking System And MethodAbandonedAug 10, 09Dec 03, 09[H01L]
2009/0298,230 Stacked Module Systems and MethodsAbandonedAug 10, 09Dec 03, 09[H01L]
2009/0273,069 LOW PROFILE CHIP SCALE STACKING SYSTEM AND METHODAbandonedMay 07, 09Nov 05, 09[H01L]
2009/0170,243 Stacked Integrated Circuit ModuleAbandonedMar 11, 09Jul 02, 09[H01L]
2009/0160,042 Managed Memory ComponentAbandonedMar 02, 09Jun 25, 09[H01L]
2008/0225,476 TAB WRAP FOLDABLE ELECTRONIC ASSEMBLY MODULE AND METHOD OF MANUFACTUREAbandonedJan 11, 06Sep 18, 08[H01R, H05K]
7324352 High capacity thin module system and methodExpiredMar 01, 05Jan 29, 08[H05K]
7289327 Active cooling methods and apparatus for modulesExpiredFeb 27, 06Oct 30, 07[H05K]
7256484 Memory expansion and chip scale stacking system and methodExpiredOct 12, 04Aug 14, 07[H01L]
2007/0114,649 Low Profile Stacking System and MethodAbandonedJan 23, 07May 24, 07[H01L]
2007/0117,262 Low Profile Stacking System and MethodAbandonedJan 23, 07May 24, 07[H01L]
2007/0111,606 Buffered Thin Module System and MethodAbandonedNov 28, 06May 17, 07[H01R]
2006/0131,716 Stacking system and methodAbandonedDec 22, 05Jun 22, 06[H01L]
2006/0091,521 Stacking system and methodAbandonedDec 21, 05May 04, 06[H01L]
6660561 Method of assembling a stackable integrated circuit chipExpiredJul 24, 02Dec 09, 03[H01L]
6573461 Retaining ring interconnect used for 3-D stackingExpiredSep 20, 01Jun 03, 03[H01R, H05K]
6404662 Rambus stakpakExpiredMar 07, 01Jun 11, 02[G11C]

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