EPCOS AG

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 121243
 
  
 
H01C RESISTORS604
 
  
 
H01G CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE 6024
 
  
 
C04B LIME; MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS 3335
 
  
 
H02H EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS 3147
 
  
 
H01F MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES 3054
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 21135
 
  
 
G01K MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR 1927
 
  
 
H03H IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS 1952
 
  
 
H01T SPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES 1314

Top Patents (by citation)

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Recent Publications

Publication # Title Filing Date Pub Date Intl Class
2018/0006,209 METHOD FOR PRODUCING PIEZOELECTRIC MULTI-LAYERED COMPONENTSJan 13, 16Jan 04, 18[H01L]
2017/0290,164 ELECTRICAL COMPONENT, COMPONENT ARRANGEMENT, AND A METHOD FOR PRODUCING AN ELECTRICAL COMPONENT AND COMPONENT ARRANGEMENTAug 31, 15Oct 05, 17[H01C, H05K, H01G]
2017/0243,696 DIELECTRIC COMPOSITION, DIELECTRIC ELEMENT, ELECTRONIC COMPONENT AND LAMINATED ELECTRONIC COMPONENTSep 08, 15Aug 24, 17[C04B, H01G]
2017/0236,634 Monolithic Ceramic Component and Production MethodNov 22, 16Aug 17, 17[H01C, H01F, H01G, B32B]
2017/0208,675 PIEZOELECTRIC TRANSFORMERJul 10, 15Jul 20, 17[H01L, H05H]
2017/0184,687 SensorJul 06, 15Jun 29, 17[G01R]
2017/0158,563 Material for a Thermoelectric Element and Method for Producing a Material for a Thermoelectric ElementJul 07, 15Jun 08, 17[H01L, C04B]
2017/0162,303 Sensor Element, Sensor Arrangement, and Method for Manufacturing a Sensor ElementJul 14, 15Jun 08, 17[H01C]
2017/0156,008 TRANSDUCER ELEMENT AND METHOD OF MANUFACTURING A TRANSDUCER ELEMENTJul 17, 14Jun 01, 17[B81C, H04R, B81B]
2017/0144,883 MICROELECTRONIC PACKAGE AND METHOD OF MANUFACTURING A MICROELECTRONIC PACKAGEJun 16, 14May 25, 17[B81C, B81B]

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9908773 Method for packaging a microelectronic device in a hermetically sealed cavity and managing the atmosphere of the cavity with a dedicated holeDec 06, 13Mar 06, 18[B81C, B81B]
9909946 Pressure sensor systemDec 14, 16Mar 06, 18[C04B, G01L]
9911536 Dielectric composition, dielectric element, electronic component and laminated electronic componentSep 08, 15Mar 06, 18[C04B, H01G]
9905363 Capacitor arrangementFeb 10, 14Feb 27, 18[H01G]
9873952 Method of producing a ceramic component having a main body with internal electrodesMay 28, 13Jan 23, 18[C25D, H01L, H01G]
9875831 Method for producing a multi-layer varistor component and a multi-layer varistor componentMay 20, 14Jan 23, 18[H01C, H01G]
9875851 Ceramic multi-layered capacitorMar 06, 17Jan 23, 18[C04B, H01G, B32B]
9865381 Chip with protection function and method for producing sameJan 02, 15Jan 09, 18[C03C, H01L, H01C]
9865394 Electrical component comprising a connection element having a plastic bodyJun 19, 13Jan 09, 18[H01G]
9842983 Piezoelectric multi-layer componentOct 07, 11Dec 12, 17[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
9418980 Light-emitting diode deviceWithdrawnApr 17, 13Aug 16, 16[H01L]
2015/0377,734 Pressure Sensor SystemAbandonedJan 20, 14Dec 31, 15[C04B, G01L]
9214714 Circuit arrangement including hybrids and duplexers between antenna, transmission and reception portsWithdrawnSep 20, 11Dec 15, 15[H01P, H04B, H03H]
2015/0146,342 Multi-Layer Component Having an External Contact and Method for Producing a Multi-Layer Component Having an External ContactAbandonedMay 06, 13May 28, 15[H01L, H01G]
2014/0368,085 Piezoelectric Component and Method for Producing a Piezoelectric ComponentAbandonedNov 07, 12Dec 18, 14[H01L]
8835819 Heating device and method for manufacturing the heating deviceWithdrawnJul 23, 09Sep 16, 14[H05B, C04B]
2013/0328,448 PIEZO ACTUATOR WITH PROTECTION AGAINST ENVIRONMENTAL INFLUENCESAbandonedNov 30, 11Dec 12, 13[H01L]
8605409 Electrical multi-layered component and circuit arrangement comprising the sameWithdrawnDec 10, 09Dec 10, 13[H01G]
2013/0300,533 Ceramic Multilayered Component and Method for Producing a Ceramic Multilayered ComponentAbandonedOct 27, 11Nov 14, 13[H01C]
2013/0181,581 Piezoelectric Multilayer ActuatorAbandonedJul 29, 11Jul 18, 13[H01L]
2013/0057,114 Piezoelectric Multilayer Component and Method for Producing a Piezoelectric Multilayer ComponentAbandonedFeb 21, 11Mar 07, 13[H01L, H04R]
2013/0032,588 HEATING ARRANGEMENTAbandonedFeb 14, 11Feb 07, 13[H05B]
2013/0015,537 PIEZORESISTIVE PRESSURE SENSOR AND PROCESS FOR PRODUCING A PIEZORESISTIVE PRESSURE SENSORAbandonedDec 14, 10Jan 17, 13[H01L]
2013/0001,218 MOLDED BODY, HEATING DEVICE AND METHOD FOR PRODUCING A MOLDED BODYAbandonedDec 09, 10Jan 03, 13[H05B, C04B, B32B]
2012/0281,335 Temperature-Independent Capacitor and Capacitor ModuleAbandonedDec 21, 10Nov 08, 12[H01G]
8305161 Multiband filterWithdrawnNov 24, 09Nov 06, 12[H04W, H03H]
2012/0181,474 CERAMIC MATERIAL AND PROCESS FOR PRODUCING THE CERAMIC MATERIALAbandonedDec 19, 11Jul 19, 12[H01L, B28B]
2012/0175,149 Functional Module and Method for Producing the Functional ModuleAbandonedJul 30, 10Jul 12, 12[H01B]
2012/0115,355 APPLIANCE INSTALLATION DEVICE AND METHOD FOR PRODUCING THE SAMEAbandonedMay 20, 10May 10, 12[B23P, H01R]
2011/0297,666 Heating Apparatus and Method for Producing the Heating ApparatusAbandonedJul 03, 09Dec 08, 11[H05B, H01C]

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