EPIC TECHNOLOGY INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 14348
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 4152
 
  
 
H01R ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS 1132

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
8590145 Method of fabricating a circuit structureOct 16, 09Nov 26, 13[H05K]
8564119 Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic systemNov 03, 09Oct 22, 13[H01L]
8533941 Method of bonding two structures together with an adhesive line of controlled thicknessOct 16, 09Sep 17, 13[H05K]
8474133 Method of fabricating a base layer circuit structureOct 16, 09Jul 02, 13[H05K]
8384199 Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic systemJun 24, 08Feb 26, 13[H01L]
8324020 Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic systemNov 03, 09Dec 04, 12[H01L]
8169065 Stackable circuit structures and methods of fabrication thereofDec 22, 09May 01, 12[H01L]
7868445 Integrated structures and methods of fabrication thereof with fan-out metallization on a chips-first chip layerJun 24, 08Jan 11, 11[H01L]
7863090 Packaged electronic modules and fabrication methods thereof implementing a cell phone or other electronic systemJun 24, 08Jan 04, 11[H01L]
7830000 Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic systemJun 24, 08Nov 09, 10[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0185,935 METHOD OF FABRICATING A BASE LAYER CIRCUIT STRUCTUREAbandonedMar 12, 13Jul 25, 13[H05K]
2006/0000,642 Interposer with compliant pinsAbandonedJul 20, 04Jan 05, 06[H05K]
2005/0205,988 Die package with higher useable die contact pad areaAbandonedJul 19, 04Sep 22, 05[H01L]
2005/0120,553 Method for forming MEMS grid array connectorAbandonedDec 08, 03Jun 09, 05[H01R]

Top Inventors for This Owner

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