EPOXY TECHNOLOGY, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 264
 
  
 
H05K PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS 2154
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 1361

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7690970 Abrasive preparation device with an improved abrasion element assemblyJan 19, 07Apr 06, 10[B24B]
6595838 Wood floor sanding machineJul 23, 01Jul 22, 03[B24B]
6219911 Flip chip mounting techniqueMar 23, 99Apr 24, 01[H05K]
5237130 Flip chip technology using electrically conductive polymers and dielectricsDec 19, 91Aug 17, 93[H05K]
5196371 Flip chip bonding method using electrically conductive polymer bumpsAug 16, 91Mar 23, 93[H01L]

Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
6410415 Flip chip mounting techniqueExpiredNov 28, 00Jun 25, 02[H01L]
6189208 Flip chip mounting techniqueExpiredAug 23, 99Feb 20, 01[H05K]
5918364 Method of forming electrically conductive polymer interconnects on electrical substratesExpiredMar 14, 97Jul 06, 99[H05K]
5879761 Method for forming electrically conductive polymer interconnects on electrical substratesExpiredJul 18, 95Mar 09, 99[B05D]
5074947 Flip chip technology using electrically conductive polymers and dielectricsExpiredDec 18, 89Dec 24, 91[C09J]
4637197 Method and compositions for removal of moistureExpiredDec 26, 85Jan 20, 87[B65B]
4272926 Face finishing tool for fiber optic communication cableExpiredNov 05, 79Jun 16, 81[B24B]

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