Express Packaging Systems, Inc.
Patent Owner
Stats
- 0 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Jun 13, 2000 most recent publication
Details
- 0 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 373 Total Citation Count
- Feb 11, 1997 Earliest Filing
- 4 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
- No Technology to Display
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Recent Publications
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Recent Patents
- No Recent Patents to Display
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
6075710 Low-cost surface-mount compatible land-grid array (LGA) chip scale package (CSP) for packaging solder-bumped flip chipsExpiredFeb 11, 99Jun 13, 00[H05K]
6057601 Heat spreader with a placement recess and bottom saw-teeth for connection to ground planes on a thin two-sided single-core BGA substrateExpiredNov 27, 98May 02, 00[H01L]
5844248 Circuit arrangement including photoelectric transducers for supplying a high voltage driving signal to an insulated gate bipolar transistorExpiredMar 04, 97Dec 01, 98[G02B]
5825084 Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devicesExpiredFeb 11, 97Oct 20, 98[H01L]
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