FARADAY TECHNOLOGY, INC.

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
C25D PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING 942
 
  
 
B23H WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL 615
 
  
 
C02F TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE 352
 
  
 
C25C PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR 217
 
  
 
C25F PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR 216
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 2360
 
  
 
B01D SEPARATION 1133
 
  
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 165
 
  
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 1205
 
  
 
H01M PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY 1153

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9546101 Electrolytic system and method for filtering an aqueous particulate suspensionJun 24, 15Jan 17, 17[C02F, B01D]
9403228 Method and apparatus for pulsed electrochemical grindingJul 29, 14Aug 02, 16[B23H]
9095808 Electrolytic system and method for filtering an aqueous particulate suspensionSep 30, 11Aug 04, 15[B01D]
9006147 Electrochemical system and method for electropolishing superconductive radio frequency cavitiesJul 11, 12Apr 14, 15[H01L, H05H, C25F]
8603315 Tin and tin alloy electroplating method with controlled internal stress and grain size of the resulting depositJan 05, 07Dec 10, 13[C25D]
8329006 Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during platingApr 28, 09Dec 11, 12[C25D]
8226804 Electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holes during platingApr 14, 11Jul 24, 12[C25D]
7947161 Method of operating an electroplating cell with hydrodynamics facilitating more uniform deposition on a workpiece with through holesAug 10, 07May 24, 11[C25D]
7022216 Electrolytic etching of metal layersJun 11, 03Apr 04, 06[C25C]
6827833 Electrodeposition of metals in high-aspect ratio cavities using modulated reverse electric fieldsOct 15, 01Dec 07, 04[C25D]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0220,819 ELECTRODEPOSITION OF CHROMIUM FROM TRIVALENT CHROMIUM USING MODULATED ELECTRIC FIELDSAbandonedFeb 15, 13Aug 29, 13[C25D]
2012/0091,002 ELECTROLYTIC SYSTEM AND METHOD FOR CONCENTRATING AN AQUEOUS PARTICULATE SUSPENSONAbandonedSep 23, 11Apr 19, 12[C25B]
2011/0303,553 ELECTROCHEMICAL SYSTEM AND METHOD FOR MACHINING STRONGLY PASSIVATING METALSAbandonedJun 06, 11Dec 15, 11[B23H]
2011/0017,608 ELECTROCHEMICAL ETCHING AND POLISHING OF CONDUCTIVE SUBSTRATESAbandonedJul 27, 10Jan 27, 11[C25F]
2008/0041,728 Electrolytic looping for forming layering in the deposit of a coatingAbandonedAug 09, 06Feb 21, 08[C25D]
2006/0207,888 Electrochemical etching of circuitry for high density interconnect electronic modulesAbandonedFeb 15, 06Sep 21, 06[C25F]
2005/0145,506 Electrochemical etching of circuitry for high density interconnect electronic modulesAbandonedDec 29, 03Jul 07, 05[B23H]
2004/0011,666 Electrolytic etching of metal layersAbandonedJun 11, 03Jan 22, 04[C25F]
2001/0054,557 ELECTROPLATING OF METALS USING PULSED REVERSE CURRENT FOR CONTROL OF HYDROGEN EVOLUTIONAbandonedJun 09, 97Dec 27, 01[C25D]

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