FICO B.V.
Patent Owner
Stats
- 2 US PATENTS IN FORCE
- 0 US APPLICATIONS PENDING
- Jun 24, 2010 most recent publication
Details
- 2 Issued Patents
- 0 Issued in last 3 years
- 0 Published in last 3 years
- 97 Total Citation Count
- Jun 13, 1994 Earliest Filing
- 26 Expired/Abandoned/Withdrawn Patents
Patent Activity in the Last 10 Years
Technologies
Intl Class
Technology
Matters
Rank in Class
Top Patents (by citation)
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Recent Publications
- No Recent Publications to Display
Recent Patents
Expired/Abandoned/Withdrawn Patents
Patent #
Title
Status
Filing Date
Issue/Pub Date
Intl Class
2010/0159,672 METHOD AND DEVICE FOR CLEANING ELECTRONIC COMPONENTS PROCESSED WITH A LASER BEAMAbandonedJun 15, 06Jun 24, 10[H01L, B23K]
7676900 Apparatus for processing a carrier with electronic componentsExpiredNov 15, 04Mar 16, 10[B23P]
2009/0115,098 Mould Part and Method for Encapsulating Electronic ComponentsAbandonedJul 26, 05May 07, 09[B29C]
7162906 Method and apparatus for removing a carrier part from a carrierExpiredJan 29, 02Jan 16, 07[H01L]
2006/0231,454 Carrier, holder, laser cutting device and method for separating semiconductor products using laser lightAbandonedJan 19, 04Oct 19, 06[B65D]
2006/0112,798 Method for releasing slug after punching, and punching machineAbandonedDec 04, 03Jun 01, 06[B26D]
2005/0062,199 Method and device for encapsulating electronic components while exerting fluid pressureAbandonedNov 16, 04Mar 24, 05[B22D]
6848174 Apparatus and method for processing electronic componentsExpiredDec 06, 02Feb 01, 05[B23P, H05K]
2004/0187,544 Method and apparatus for removing a carrier part from a carrier with a single operation, and a product removed from a carrierAbandonedMay 12, 04Sep 30, 04[B21D]
2004/0090,221 Device and method for testing electronic componentsAbandonedDec 10, 03May 13, 04[G01R]
2003/0159,907 Method and device for transporting electronic componentsAbandonedApr 24, 03Aug 28, 03[H05K]
6588308 Method and device for separating products, mounted on a common substrate, from each other along (a) cutting line(s)ExpiredNov 29, 99Jul 08, 03[B26D]
6507185 Device, assembly and method for testing electronic components, and calibrating method thereforExpiredNov 09, 00Jan 14, 03[G01R]
6428731 Mould part, mould and method for encapsulating electronic components mounted on a carrierExpiredNov 09, 00Aug 06, 02[B29C]
6200504 Method for encapsulating with plastic a lead frame with chipsExpiredJun 09, 97Mar 13, 01[B29C]
6165405 Press for encapsulating electronic components and methods for use of the pressExpiredOct 19, 98Dec 26, 00[B29C]
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