F & K Delvotec Bondtechnik GmbH

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 885
 
  
 
G01N INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES 3203
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 3359
 
  
 
B23B TURNING; BORING 151
 
  
 
B65G TRANSPORT OR STORAGE DEVICES, e.g. CONVEYERS FOR LOADING OR TIPPING; SHOP CONVEYER SYSTEMS; PNEUMATIC TUBE CONVEYERS 166

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
7735711 Method of testing bonded connections, and a wire bonderNov 26, 07Jun 15, 10[B23K]
7458496 Wire bonder and method of operating the sameAug 10, 05Dec 02, 08[B23K]
6912906 Method and apparatus for the production and quality testing of a bonded wire connectionJun 08, 04Jul 05, 05[G01N]
6905058 Bonding tool and wire bonderJun 18, 03Jun 14, 05[B23K]
6758385 Apparatus for performing a pull testMar 15, 02Jul 06, 04[B23K, G01N]
6745629 Method and apparatus for the production and quality testing of a bonded wire connectionMay 31, 02Jun 08, 04[G01N]
5979737 Ultrasonic bonding head comprising a linear motor for adjusting the pressure according to a piezo detectorJun 17, 97Nov 09, 99[B23K]
5950903 Bonding headMar 25, 97Sep 14, 99[H01L]
5906706 Wire guide for a bonding machineJun 12, 97May 25, 99[H01L]
5452838 Bonding head for an ultrasonic bonding machineDec 10, 93Sep 26, 95[B23K]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2011/0259,939 TRANSDUCER OF AN ULTRASONIC BONDERAbandonedApr 22, 10Oct 27, 11[B23K]
6891730 Circuit housingExpiredNov 13, 01May 10, 05[H05K]
6827248 Cutting device for bonded wiresExpiredAug 06, 02Dec 07, 04[B23K]
2003/0085,255 Method of testing bonded connections, and a wire bonderAbandonedMar 01, 02May 08, 03[B23K]
6206275 Deep access, close proximity, fine pitch bonding of large wireExpiredMar 01, 00Mar 27, 01[B23K]
5018658 Bonding wedgeExpiredApr 12, 90May 28, 91[H01L, B23K]
4984730 Quality control for wire bondingExpiredNov 03, 89Jan 15, 91[H01L, B23K]
4928871 Apparatus and method of controlled feed of a bonding wire to the "wedge" of a bonding headExpiredFeb 22, 89May 29, 90[H05K]
4925083 Ball bonding method and apparatus for performing the methodExpiredOct 05, 88May 15, 90[B23K]
4878609 Apparatus for manual wire bondingExpiredFeb 18, 88Nov 07, 89[B23K]
4781319 Bonding headExpiredMay 30, 86Nov 01, 88[B23K]

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