FLIPCHIP INTERNATIONAL, LLC

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 22340
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 192
 
  
 
F01L CYCLICALLY OPERATING VALVES FOR MACHINES OR ENGINES 154
 
  
 
G03F PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR 1103

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
9831201 Methods for forming pillar bumps on semiconductor wafersMar 11, 15Nov 28, 17[H01L]
9627254 Method for building vertical pillar interconnectMar 14, 13Apr 18, 17[H01L]
9070747 Electroplating using dielectric bridgesSep 27, 13Jun 30, 15[H01L]
9018750 Thin film structure for high density inductors and redistribution in wafer level packagingAug 10, 12Apr 28, 15[H01L]
8980743 Method for applying a final metal layer for wafer level packaging and associated deviceMar 07, 13Mar 17, 15[H01L]
8754524 Wafer-level interconnect for high mechanical reliability applicationsFeb 16, 12Jun 17, 14[H01L]
8686556 Wafer level applied thermal heat sinkOct 04, 12Apr 01, 14[H01L]
8446019 Solder bump interconnectApr 26, 12May 21, 13[H01L]
8375906 Camshaft phaser for a concentric camshaftOct 02, 09Feb 19, 13[F01L]
8188606 Solder bump interconnectApr 13, 11May 29, 12[H01L]

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Expired/Abandoned/Withdrawn Patents

Patent # Title Status Filing Date Issue/Pub Date Intl Class
2013/0244,382 HIGH PRECISION SELF ALIGNING DIE FOR EMBEDDED DIE PACKAGINGAbandonedSep 14, 12Sep 19, 13[H01L]
2013/0093,067 WAFER LEVEL APPLIED RF SHIELDSAbandonedOct 09, 12Apr 18, 13[H01L]
2011/0003,470 METHODS AND STRUCTURES FOR A VERTICAL PILLAR INTERCONNECTAbandonedJun 30, 10Jan 06, 11[H01L]
2009/0057,909 UNDER BUMP METALLIZATION STRUCTURE HAVING A SEED LAYER FOR ELECTROLESS NICKEL DEPOSITIONAbandonedJun 19, 08Mar 05, 09[H01L]
2009/0014,869 SEMICONDUCTOR DEVICE PACKAGE WITH BUMP OVERLYING A POLYMER LAYERAbandonedOct 28, 05Jan 15, 09[H01L]
7429779 Semiconductor device having gate electrode connection to wiring layerExpiredJul 26, 05Sep 30, 08[H01L]
2008/0136,019 Solder Bump/Under Bump Metallurgy Structure for High Temperature ApplicationsAbandonedDec 11, 06Jun 12, 08[H01L]
6919508 Build-up structures with multi-angle vias for chip to chip interconnects and optical bussingExpiredNov 10, 03Jul 19, 05[H01L]
6750135 Method for forming chip scale packageExpiredJun 20, 01Jun 15, 04[H01L, B23K]

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