FLIPCHIP INTERNATIONAL

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Patent Activity in the Last 10 Years

Technologies

Intl Class Technology Matters Rank in Class
 
  
 
H01L SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR 4358
 
  
 
B32B LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM2155
 
  
 
B23K SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM 192
 
  
 
B24B MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING 165

Top Patents (by citation)

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Recent Publications

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Recent Patents

Patent # Title Filing Date Issue Date Intl Class
6375062 Surface bumping method and structure formed therebyNov 06, 00Apr 23, 02[B23K]
6281106 Method of solder bumping a circuit componentNov 25, 99Aug 28, 01[H01L]
6251501 Surface mount circuit device and solder bumping method thereforMar 29, 99Jun 26, 01[B32B]
6184581 Solder bump input/output pad for a surface mount circuit deviceNov 24, 97Feb 06, 01[H01L]
5803340 Composite solder paste for flip chip bumpingSep 29, 95Sep 08, 98[H01L]
5632667 No coat backside wafer grinding processJun 29, 95May 27, 97[B24B]
5607099 Solder bump transfer device for flip chip integrated circuit devicesApr 24, 95Mar 04, 97[H01L]
5547740 Solderable contacts for flip chip integrated circuit devicesMar 23, 95Aug 20, 96[B32B]

Expired/Abandoned/Withdrawn Patents

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Top Inventors for This Owner

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